Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NCOA1 | Q15788 | 1/20 | 0.61 |
| ▸ | NCOA3 | Q9Y6Q9 | 1/20 | 0.61 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.58 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.58 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.48 |
| ▸ | MAPT | P10636 | 1/20 | 0.48 |
| ▸ | CRHBP | P24387 | 1/20 | 0.48 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.48 |
| ▸ | TP53 | P04637 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | RAB9A | P51151 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.45 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.45 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.45 |
| ▸ | GAA | P10253 | 2/20 | 0.44 |
| ▸ | RCE1 | Q9Y256 | 1/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.42 |
| ▸ | IKBKB | O14920 | 1/20 | 0.42 |
| ▸ | BRAF | P15056 | 1/20 | 0.42 |
| ▸ | BRD4 | O60885 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25135214 | 0.88 | ALDH1A1 (0.52) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL560389 | 0.87 | MAPT (0.56) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL112422 | 0.87 | NCOA1 (0.63) | NCOA1NCOA3ALDH1A1HSD17B10TP53 | |
| SCHEMBL3386558 | 0.86 | NCOA1 (0.56) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL1078322 | 0.86 | NCOA1 (0.47) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL560390 | 0.85 | KDM4E (0.52) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL25135311 | 0.85 | NCOA1 (0.54) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| Ammonia Solution, Strong SCHEMBL6730704 | 0.85 | MAPT (0.54) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL1078321 | 0.85 | MAPT (0.54) | NCOA1NCOA3ALDH1A1HSD17B10KDM4E | |
| SCHEMBL10756496 | 0.84 | NCOA1 (0.61) | NCOA1NCOA3ALDH1A1HSD17B10TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115362535-A | UV curable resin composition suitable for redistribution layers | 设计分子有限公司 | 2022-11-18 | — | — | CN | claimed |
| CN-109705799-B | YASI epoxy organic imide silica gel and preparation method thereof | 东华大学 | 2022-03-18 | — | — | CN | claimed |
| CN-109722212-B | Imide epoxy organic silica gel and preparation method thereof | 福建省海钛智能科技有限公司 | 2021-12-28 | — | — | CN | claimed |
| CN-107082996-A | Graphene oxide crosslinked polyimide semi-interpenetrating network type composite membrane and its preparation | 同济大学 | 2017-08-22 | — | — | CN | claimed |
| CN-104878130-B | A kind of complex function amino resin tanning agent and preparation method thereof | 兄弟科技股份有限公司 | 2017-03-29 | — | — | CN | claimed |
| CN-117700990-A | Resin composition, adhesive, coating agent, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2024-03-15 | — | — | CN | disclosed |
| CN-117425701-A | Polyamic acid composition, polyimide, laminate thereof, flexible device, and method for producing laminate | 株式会社钟化 | 2024-01-19 | — | — | CN | disclosed |
| CN-117120516-A | Polyimide, resin composition, polyimide film, and method for producing same | 旭化成株式会社 | 2023-11-24 | — | — | CN | disclosed |
| CN-117043230-A | Polyamic acid, polyamic acid solution, polyimide substrate, laminate, and method for producing same | 株式会社钟化 | 2023-11-10 | — | — | CN | disclosed |
| CN-116963387-A | Copper foil, flexible copper-clad laminate and printed circuit made of same | 杜邦电子公司 | 2023-10-27 | — | — | CN | disclosed |
| CN-116554828-A | Water-soluble polyimide binder and preparation method and application thereof | 宁波博雅聚力新材料科技有限公司 | 2023-08-08 | — | — | CN | disclosed |
| CN-112011308-B | Composition, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2023-05-30 | — | — | CN | disclosed |
| US-20070190882-A1 | Laminate and method | GENERAL ELECTRIC | 2007-08-16 | — | — | US | disclosed |
| US-20060281840-A1 | Stabilization of polyetherimide sulfones | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2006-12-14 | — | — | US | disclosed |
| US-20060270825-A1 | Precipitative process to prepare polyimides | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2006-11-30 | — | — | US | disclosed |
| EP-1639044-A2 | POLYIMIDE RESIN WITH REDUCED MOLD DEPOSIT | GENERAL ELECTRIC COMPANY (US) | 2006-03-29 | — | — | EP | disclosed |
| US-6919422-B2 | Polyimide resin with reduced mold deposit | GENERAL ELECTRIC COMPANY (US) | 2005-07-19 | — | — | US | disclosed |
| WO-2004113446-A2 | POLYIMIDE RESIN WITH REDUCED MOLD DEPOSIT | GENERAL ELECTRIC COMPANY (US) | 2004-12-29 | — | — | WO | disclosed |
| US-20040260055-A1 | Polyimide resin with reduced mold deposit | GENERAL ELECTRIC COMPANY | 2004-12-23 | — | — | US | disclosed |
| EP-0387203-A2 | Polyamides and polyimides with non-reactive terminal groups | CIBA-GEIGY AG (CH) | 1990-09-12 | — | — | EP | disclosed |