SCHEMBL5079516

SCHEMBL5079516

C=C[SiH2]N(C)[Si](C)(C)N(C)[Si](C)(C)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29548159 0.81
SCHEMBL17995598 0.72
SCHEMBL5486597 0.71
SCHEMBL5486595 0.64
SCHEMBL3679737 0.62
SCHEMBL3679739 0.62
SCHEMBL610281 0.61
SCHEMBL7590799 0.58
SCHEMBL2270442 0.58
SCHEMBL9635607 0.56 ALDH1A1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025070728-A1 SILICONE RUBBER COMPOSITION, SILICONE RUBBER, AND SILICONE RUBBER FOAM モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 2025-04-03 WO disclosed
US-11958951-B2 Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-04-16 US disclosed
US-20220289969-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-09-15 US disclosed
US-20220275122-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-09-01 US disclosed
CN-114174433-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed
CN-114174411-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed
CN-108473769-B Silicone rubber composition, method for producing same, and silicone rubber extrusion molded article 迈图高新材料日本合同公司 2021-03-16 CN disclosed
WO-2021024923-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 WO disclosed
WO-2021024924-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 WO disclosed
EP-3392314-B1 SILICONE RUBBER COMPOSITION, METHOD OF PRODUCING THE SAME, AND SILICONE RUBBER EXTRUDATE MOMENTIVE PERFORMANCE MAT JP (JP) 2020-12-02 EP disclosed
US-8865784-B2 Composition for silicone rubber foam, manufacturing method of silicone rubber foam, and silicone rubber foam MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC (JP) 2014-10-21 US disclosed
US-20140288197-A1 COMPOSITION FOR SILICONE RUBBER FOAM, MANUFACTURING METHOD OF SILICONE RUBBER FOAM, AND SILICONE RUBBER FOAM MOMENTIVE PERFORMANCE MAT JP (JP) 2014-09-25 US disclosed
US-20140024730-A1 COMPOSITION FOR SILICONE RUBBER FOAM, MANUFACTURING METHOD OF SILICONE RUBBER FOAM, AND SILICONE RUBBER FOAM MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC (JP) 2014-01-23 US disclosed
US-20080076864-A1 SILICONE RUBBER COMPOSITION WHICH CURES BY CONDENSATION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-03-27 US disclosed
EP-1312648-B1 Room tempertature curable silicone rubber composition SHINETSU CHEMICAL CO (JP) 2007-01-03 EP disclosed
US-6756425-B2 CONDENSATION CURABLE SILICONE RUBBER COMPOSITION IS PROVIDED WHICH IS ABLE TO SUPPRESS INCREASES IN VISCOSITY OVER TIME, HAS AN ADEQUATE POT LIFE AND EXCELLENT MOLD RELEASABILITY, AND DISPLAYS FAVORABLE URETHANE MOLDING DURABILITY. THE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-06-29 US disclosed
US-20030109602-A1 Room temperature curable silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-06-12 US disclosed
EP-1312648-A2 Room tempertature curable silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-21 EP disclosed
US-6376923-B1 LIQUID EPOXY RESIN, CURING AGENT, COPOLYMER OF ALKENYL GROUP-CONTAINING EPOXY RESIN AND AN SIH GROUP-CONTAINING ORGANOPOLYSILOXANE, INORGANIC FILLER SURFACE TREATED WITH AN AMINOSILANE OR ORGANOSILAZANE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-04-23 US disclosed
US-6331588-B1 WITH REINFORCING SILICA FINES HAVING BEEN SURFACE TREATED SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-18 US disclosed