SCHEMBL5081850

SCHEMBL5081850

O=C1C(O)=C(Cl)C(=O)C(O)=C1Cl.[CaH2]

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.44
ALDH1A1 P00352 3/20 0.44
TDP1 Q9NUW8 3/20 0.44
MEN1 O00255 2/20 0.44
MAPT P10636 2/20 0.44
ALOX15 P16050 2/20 0.44
ALOX12 P18054 2/20 0.44
KMT2A Q03164 2/20 0.44
CES2 O00748 2/20 0.44
BCHE P06276 2/20 0.44
ACHE P22303 2/20 0.44
CES1 P23141 2/20 0.44
HSD17B10 Q99714 2/20 0.44
BLM P54132 1/20 0.44
TP53 P04637 1/20 0.44
CYP3A4 P08684 1/20 0.44
HPGD P15428 1/20 0.44
TSHR P16473 1/20 0.44
MAPK1 P28482 1/20 0.44
RECQL P46063 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL223460 0.96 ALDH1A1 (0.47) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL27797012 0.93 KDM4E (0.44) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL5081810 0.93 KDM4E (0.44) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL929847 0.93 KDM4E (0.44) KDM4EALDH1A1TDP1MEN1MAPT
Water SCHEMBL9062657 0.93 KDM4E (0.50) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL3320693 0.93 KDM4E (0.44) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL11052798 0.90 KDM4E (0.60) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL7528812 0.81 KDM4E (0.57) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL10312239 0.80 DUSP3 (0.39) KDM4EALDH1A1TDP1MEN1MAPT
SCHEMBL18403440 0.74 APEX1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1497374-B1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GEN ELECTRIC (US) 2008-08-13 EP disclosed
US-7244778-B2 Filler reinforced polyether imide resin composition and molded article thereof GENERAL ELECTRIC COMPANY (US) 2007-07-17 US disclosed
CN-1314761-C Filler reinforced polyether imide resin composition and molded article thereof GEN ELECTRIC (US) 2007-05-09 CN disclosed
CN-1659234-A filler-reinforced polyetherimide resin composition and molded article thereof GEN ELECTRIC (US) 2005-08-24 CN disclosed
US-20050131105-A1 Filler reinforced polyether imide resin composition and molded article thereof SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2005-06-16 US disclosed
EP-1497374-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPANY (US) 2005-01-19 EP disclosed
WO-2003087226-A1 FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF GENERAL ELECTRIC COMPAMY (US) 2003-10-23 WO disclosed