⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL51902 | 0.74 | — | — | |
| SCHEMBL1889664 | 0.74 | — | — | |
| SCHEMBL972795 | 0.72 | — | — | |
| SCHEMBL9576213 | 0.72 | — | — | |
| SCHEMBL51578 | 0.72 | — | — | |
| SCHEMBL6842419 | 0.69 | — | — | |
| SCHEMBL7650660 | 0.69 | — | — | |
| SCHEMBL10527312 | 0.67 | — | — | |
| SCHEMBL6140725 | 0.67 | — | — | |
| SCHEMBL5819879 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 355 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6348725-B1 | — | — | None | — | — | US | claimed |
| US-20190221771-A1 | BUFFER LAYER FOR ORGANIC LIGHT EMITTING DEVICES AND METHOD OF MAKING THE SAME | UNIVERSAL DISPLAY CORPORATION | 2019-07-18 | — | — | US | claimed |
| US-20170117503-A1 | BUFFER LAYER FOR ORGANIC LIGHT EMITTING DEVICES AND METHOD OF MAKING THE SAME | UNIVERSAL DISPLAY CORPORATION | 2017-04-27 | — | — | US | claimed |
| US-20160118621-A1 | HYBRID BARRIER LAYER FOR SUBSTRATES AND ELECTRONIC DEVICES | UNIVERSAL DISPLAY CORPORATION | 2016-04-28 | — | — | US | claimed |
| WO-2015002756-A1 | HYBRID BARRIER LAYER FOR SUBSTRATES AND ELECTRONIC DEVICES | UNIVERSAL DISPLAY CORPORATION (US) | 2015-01-08 | — | — | WO | claimed |
| US-8349746-B2 | Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure | APPLIED MATERIALS, INC. (US) | 2013-01-08 | — | — | US | claimed |
| WO-2012087493-A2 | IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE | APPLIED MATERIALS, INC. (US) | 2012-06-28 | — | — | WO | claimed |
| US-20120156890-A1 | IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE | APPLIED MATERIALS, INC. (US) | 2012-06-21 | — | — | US | claimed |
| WO-2012064491-A2 | PROCESS FOR LOWERING ADHESION LAYER THICKNESS AND IMPROVING DAMAGE RESISTANCE FOR THIN ULTRA LOW-K DIELECTRIC FILM | APPLIED MATERIALS, INC. (US) | 2012-05-18 | — | — | WO | claimed |
| US-20120121823-A1 | PROCESS FOR LOWERING ADHESION LAYER THICKNESS AND IMPROVING DAMAGE RESISTANCE FOR THIN ULTRA LOW-K DIELECTRIC FILM | APPLIED MATERIALS, INC. (US) | 2012-05-17 | — | — | US | claimed |
| US-20010026849-A1 | Method of improving moisture resistance of low dielectric constant films | APPLIED MATERIALS, INC. | 2001-10-04 | — | — | US | claimed |
| EP-1131846-A1 | CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS | Applied Materials, Inc. (US) | 2001-09-12 | — | — | EP | claimed |
| US-20010005546-A1 | PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | APPLIED MATERIALS, INC. | 2001-06-28 | — | — | US | claimed |
| US-20010004479-A1 | PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | APPLIED MATERIALS, INC. | 2001-06-21 | — | — | US | claimed |
| US-6245690-B1 | EXPOSING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITED FILM OF OXIDIZED ORGANOSILICON COMPOUND TO A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE PRIOR TO THERMALLY CURING TO CONTROL CARBON CONTENT IN DEPOSITED FILM | APPLIED MATERIALS, INC. | 2001-06-12 | — | — | US | claimed |
| US-6171945-B1 | CVD nanoporous silica low dielectric constant films | APPLIED MATERIALS, INC. | 2001-01-09 | — | — | US | claimed |
| EP-1063692-A1 | Process for depositing a low dielectric constant film | Applied Materials, Inc. (US) | 2000-12-27 | — | — | EP | claimed |
| EP-1055012-A2 | PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | Applied Materials, Inc. (US) | 2000-11-29 | — | — | EP | claimed |
| WO-2000024050-A1 | CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS | APPLIED MATERIALS, INC. (US) | 2000-04-27 | — | — | WO | claimed |
| WO-1999041423-A2 | PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | APPLIED MATERIALS, INC. (US) | 1999-08-19 | — | — | WO | claimed |