SCHEMBL5088910

SCHEMBL5088910

C=C([SiH3])CCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7042248 0.91
SCHEMBL4517092 0.88 CES2 (0.48)
SCHEMBL8863161 0.80
SCHEMBL4244087 0.73 CES1 (0.47)
SCHEMBL1353582 0.73 CES1 (0.47)
SCHEMBL9293686 0.73
SCHEMBL821275 0.71
SCHEMBL3415091 0.71
SCHEMBL866535 0.71
Ammonia Solution, Strong SCHEMBL2638345 0.71 CES1 (0.45)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008108377-A1 CONJUGATED DIENE-BASED POLYMER, METHOD FOR MANUFACTURING THE SAME, AND CONJUGATED DIENE POLYMER COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2008-09-12 WO disclosed
EP-1085022-A1 A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds Dow Corning Asia, Ltd. (JP) 2001-03-21 EP disclosed
US-6060620-A Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds DOW CORNING ASIA, LTD. (JP) 2000-05-09 US disclosed