SCHEMBL513200

SCHEMBL513200

C=C(CCCCCCCCCO)OC(=C)CCCCCCCCCO

nearest known ligand 0.42

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.42
FFAR1 O14842 1/20 0.42
FFAR4 Q5NUL3 1/20 0.42
LMNA P02545 2/20 0.35
ALDH1A1 P00352 1/20 0.35
HSD17B10 Q99714 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
TSHR P16473 1/20 0.35
SMN1; SMN2 Q16637 2/20 0.34
KDM4E B2RXH2 1/20 0.34
GAA P10253 1/20 0.33
FNTA P49354 1/20 0.32
FNTB P49356 1/20 0.32
MIF P14174 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL503778 1.00 GPR84 (0.42) GPR84FFAR1FFAR4LMNAALDH1A1
SCHEMBL9994953 1.00 GPR84 (0.42) GPR84FFAR1FFAR4LMNAALDH1A1
SCHEMBL9995212 1.00 GPR84 (0.42) GPR84FFAR1FFAR4LMNAALDH1A1
SCHEMBL9994838 1.00 GPR84 (0.42) GPR84FFAR1FFAR4LMNAALDH1A1
SCHEMBL3231029 1.00 GPR84 (0.42) GPR84FFAR1FFAR4LMNAALDH1A1
SCHEMBL75521 0.97 GPR84 (0.38) GPR84FFAR1FFAR4LMNAALDH1A1
SCHEMBL1552372 0.88 CAMK2A (0.36)
SCHEMBL15247887 0.79 GPR84 (0.39) GPR84FFAR1FFAR4LMNAALDH1A1
Octane SCHEMBL87802 0.76 CES2 (0.46) GPR84FFAR1FFAR4ALDH1A1HSD17B10
SCHEMBL8991757 0.76 CES2 (0.46) GPR84FFAR1FFAR4ALDH1A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8742025-B2 Adhesive composition and polarizing plate comprising the same DONGWOO FINE-CHEM CO., LTD. (KR) 2014-06-03 US claimed
US-20110293933-A1 Adhesive composition and polarizing plate comprising the same DONGWOO FINE-CHEM CO., LTD. (KR) 2011-12-01 US claimed
CN-113272383-B Composition and method for producing the same 电化株式会社 2023-11-17 CN disclosed
CN-113227169-B Sealant, cured body, organic electroluminescent display device, and method for manufacturing device 电化株式会社 2023-10-31 CN disclosed
CN-115279768-A Stereoisomer of epoxy compound, curable composition containing same, and cured product obtained by curing curable composition 引能仕株式会社 2022-11-01 CN disclosed
CN-114746392-A Alicyclic acrylate compound, alicyclic epoxy acrylate compound, curable composition, and cured product 引能仕株式会社 2022-07-12 CN disclosed
CN-113646354-A Curable composition and cured product thereof 引能仕株式会社 2021-11-12 CN disclosed
CN-109312056-B Epoxy compound, curable composition containing same, and cured product obtained by curing curable composition JXTG能源株式会社 2021-10-01 CN disclosed
CN-109311906-B Epoxy compound, curable composition containing same, and cured product obtained by curing curable composition JXTG能源株式会社 2021-08-03 CN disclosed
CN-113072684-A Curable composition and cured product obtained by curing same JXTG能源株式会社 2021-07-06 CN disclosed
CN-109071776-B Curable composition and cured product obtained by curing same JXTG能源株式会社 2021-06-08 CN disclosed
US-20090087626-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-20090085256-A1 IMAGE FORMING METHOD AND APPARATUS FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
EP-2042574-A1 White ink composition, inkjet recording method, and printed material FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
EP-2042572-A1 Ink composition, inkjet recording method, printed material, and process for producing molded printed material FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
EP-1975213-A1 Ink composition, injet recording method, printed material, and process for producing lithographic printing plate FUJIFILM Corporation (JP) 2008-10-01 EP disclosed
US-20080075882-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080008966-A1 Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate FUJIFILM CORPORATION (JP) 2008-01-10 US disclosed
EP-1876209-A1 Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate FUJIFILM Corporation (JP) 2008-01-09 EP disclosed
US-20030105266-A1 Curable resin composition YOKOHAMA RUBBER CO., LTD. (JP) 2003-06-05 US disclosed