Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC9A1 | P19634 | 7/20 | 0.70 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.70 |
| ▸ | POLB | P06746 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.46 |
| ▸ | ATM | Q13315 | 1/20 | 0.46 |
| ▸ | APAF1 | O14727 | 1/20 | 0.43 |
| ▸ | RAB9A | P51151 | 2/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | DGAT1 | O75907 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.42 |
| ▸ | THPO | P40225 | 1/20 | 0.42 |
| ▸ | CYP4Z1 | Q86W10 | 1/20 | 0.42 |
| ▸ | HCAR3 | P49019 | 1/20 | 0.41 |
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL170155 | 0.84 | SLC9A1 (1.00) | SLC9A1KEAP1POLBMAPK1ATM | |
| SCHEMBL29720118 | 0.84 | SLC9A1 (1.00) | SLC9A1KEAP1POLBMAPK1ATM | |
| SCHEMBL2925766 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| Ammonia Solution, Strong SCHEMBL4635177 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| Water SCHEMBL29255956 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| Hydrochloric Acid SCHEMBL9284746 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| SCHEMBL3673451 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| SCHEMBL1151656 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| SCHEMBL30431949 | 0.82 | SLC9A1 (0.95) | SLC9A1KEAP1POLBMAPK1ATM | |
| SCHEMBL2479198 | 0.80 | RAB9A (0.51) | SLC9A1KEAP1POLBMAPK1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 124 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9486892-B2 | Polishing composition | FUJIMI INCORPORATED (JP) | 2016-11-08 | — | — | US | claimed |
| US-8864860-B2 | Polishing composition | FUJIMI INCORPORATED (JP) | 2014-10-21 | — | — | US | claimed |
| US-20070181534-A1 | Barrier polishing liquid and chemical mechanical polishing method | FUJIFILM CORPORATION (JP) | 2007-08-09 | — | — | US | claimed |
| US-6814767-B2 | SILICA SOL, POLYOXYETHYLENE ALKYL ETHER SULFATE, BENZOTRIAZOLE CORROSION INHIBITOR, ACID AND WATER; INSULATING LAYER EROSION PREVENTION | FUJIMI INCORPORATED (JP) | 2004-11-09 | — | — | US | claimed |
| US-20040134376-A1 | Polishing composition | FUJIMI INCORPORATED (JP) | 2004-07-15 | — | — | US | claimed |
| EP-4471834-B1 | POLISHING SOLUTION AND POLISHING METHOD | FUJIFILM CORP (JP) | 2026-03-04 | — | — | EP | disclosed |
| US-20250189895-A1 | METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| WO-2025105122-A1 | METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND KIT | 富士フイルム株式会社 | 2025-05-22 | — | — | WO | disclosed |
| EP-4471834-A1 | POLISHING SOLUTION AND POLISHING METHOD | FUJIFILM Corporation (JP) | 2024-12-04 | — | — | EP | disclosed |
| US-20240368428-A1 | POLISHING LIQUID AND POLISHING METHOD | FUJIFILM CORPORATION (JP) | 2024-11-07 | — | — | US | disclosed |
| US-11992914-B2 | Polishing composition, polishing method, and method for producing substrate | FUJIMI INCORPORATED (JP) | 2024-05-28 | — | — | US | disclosed |
| WO-2023140049-A1 | POLISHING SOLUTION AND POLISHING METHOD | 富士フイルム株式会社 | 2023-07-27 | — | — | WO | disclosed |
| EP-1640424-A1 | Polishing composition and process for producing wiring structure using it | FUJIMI INCORPORATED (JP) | 2006-03-29 | — | — | EP | disclosed |
| US-20060060974-A1 | Polishing composition and process for producing wiring structure using it | FUJIMI INCORPORATED (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20050204637-A1 | Polishing composition and polishing method | FUJIMI INCORPORATED | 2005-09-22 | — | — | US | disclosed |
| US-20050208761-A1 | Polishing composition and polishing method | FUJIMI INCORPORATED (JP) | 2005-09-22 | — | — | US | disclosed |
| US-20050108949-A1 | Polishing composition | FUJIMI INCORPORATED (JP) | 2005-05-26 | — | — | US | disclosed |
| EP-1520892-A2 | Polishing composition | FUJIMI INCORPORATED (JP) | 2005-04-06 | — | — | EP | disclosed |
| US-6814767-B2 | SILICA SOL, POLYOXYETHYLENE ALKYL ETHER SULFATE, BENZOTRIAZOLE CORROSION INHIBITOR, ACID AND WATER; INSULATING LAYER EROSION PREVENTION | FUJIMI INCORPORATED (JP) | 2004-11-09 | — | — | US | disclosed |
| US-20040134376-A1 | Polishing composition | FUJIMI INCORPORATED (JP) | 2004-07-15 | — | — | US | disclosed |