Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | MAPT | P10636 | 2/20 | 0.43 |
| ▸ | SIGMAR1 | Q99720 | 3/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | DRD2 | P14416 | 5/20 | 0.34 |
| ▸ | DRD4 | P21917 | 5/20 | 0.34 |
| ▸ | DRD3 | P35462 | 5/20 | 0.34 |
| ▸ | KCNH3 | Q9ULD8 | 1/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
| ▸ | IDO1 | P14902 | 1/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | ROCK1 | Q13464 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4738119 | 0.94 | ALDH1A1 (0.52) | ALDH1A1MAPTSIGMAR1L3MBTL1DRD2 | |
| SCHEMBL134305 | 0.91 | ALDH1A1 (0.53) | ALDH1A1MAPTL3MBTL1KCNH3CYP1A2 | |
| Hydrochloric Acid SCHEMBL29522911 | 0.89 | ALDH1A1 (0.52) | ALDH1A1MAPTL3MBTL1KCNH3CYP1A2 | |
| SCHEMBL2116813 | 0.86 | ALDH1A1 (0.52) | ALDH1A1MAPTL3MBTL1KCNH3CYP1A2 | |
| SCHEMBL16147721 | 0.85 | MAPT (0.47) | ALDH1A1MAPTL3MBTL1KCNH3CYP1A2 | |
| SCHEMBL6441905 | 0.85 | ALDH1A1 (0.47) | ALDH1A1MAPTSIGMAR1L3MBTL1KCNH3 | |
| SCHEMBL23361372 | 0.84 | ALDH1A1 (0.50) | ALDH1A1MAPTL3MBTL1KCNH3 | |
| SCHEMBL17766159 | 0.84 | ALDH1A1 (0.50) | ALDH1A1MAPTL3MBTL1KCNH3 | |
| SCHEMBL17766143 | 0.84 | ALDH1A1 (0.50) | ALDH1A1MAPTL3MBTL1KCNH3 | |
| SCHEMBL25438578 | 0.84 | MAPT (0.46) | ALDH1A1MAPTSIGMAR1L3MBTL1DRD2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4797307-A | IMIDATION OF POLYAMIDES | UBE INDUSTRIES, LTD. (JP) | 1989-01-10 | — | — | US | claimed |
| US-20250284195-A1 | CURABLE RESIN COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM | SAMSUNG SDI CO LTD (KR) | 2025-09-11 | — | — | US | disclosed |
| US-12321096-B2 | Curable resin composition, cured film formed therefrom, and electronic device having cured film | SAMSUNG SDI CO., LTD. (KR) | 2025-06-03 | — | — | US | disclosed |
| CN-117334646-A | Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-01-02 | — | — | CN | disclosed |
| CN-111386594-B | Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2023-10-13 | — | — | CN | disclosed |
| CN-114127197-B | Curable resin composition, cured film, and electronic device | 三星SDI株式会社 | 2023-09-26 | — | — | CN | disclosed |
| US-11682564-B2 | Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device | RESONAC CORPORATION (JP) | 2023-06-20 | — | — | US | disclosed |
| US-20220260911-A1 | CURABLE RESIN COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM | SAMSUNG SDI CO., LTD. (KR) | 2022-08-18 | — | — | US | disclosed |
| US-11364712-B2 | Hard coating film and image display apparatus comprising same | DONGWOO FINE-CHEM CO., LTD (KR) | 2022-06-21 | — | — | US | disclosed |
| CN-114127197-A | Curable resin composition, cured film formed therefrom, and electronic device having cured film | 三星SDI株式会社 | 2022-03-01 | — | — | CN | disclosed |
| CN-101497694-A | Polyimide film, and method for production thereof | UBE INDUSTRIES (JP) | 2009-08-05 | — | — | CN | disclosed |
| US-20090117374-A1 | POLYIMIDE FILM FOR METALLIZING, AND METAL-LAMINATED POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2009-05-07 | — | — | US | disclosed |
| US-20080241497-A1 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2008-10-02 | — | — | US | disclosed |
| US-20080038522-A1 | POLYIMIDE FILM AND POLYIMIDE COMPOSITE SHEET | UBE INDUSTRIES, LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20070196675-A1 | Adhesion-Enhanced Polyimide Film, Process for Its Production, And Laminated Body | UBE INDUSTRIES, LTD. (JP) | 2007-08-23 | — | — | US | disclosed |
| US-20060068184-A1 | Polyimide film and polyimide composite sheet | UBE INDUSTRIES, LTD. (JP) | 2006-03-30 | — | — | US | disclosed |
| WO-2005090069-A1 | ADHESION-ENHANCED POLYIMIDE FILM, PROCESS FOR ITS PRODUCTION, AND LAMINATED BODY | UBE INDUSTRIES, LTD. (JP) | 2005-09-29 | — | — | WO | disclosed |
| US-6143399-A | FRAMES FOR ELECTRONICS | UBE INDUSTRIES, LTD. (JP) | 2000-11-07 | — | — | US | disclosed |
| US-5130192-A | Adhesion, surface treatment with anchoring agent, vapor deposition, plating | UBE INDUSTRIES, LTD. (JP) | 1992-07-14 | — | — | US | disclosed |
| US-4797307-A | IMIDATION OF POLYAMIDES | UBE INDUSTRIES, LTD. (JP) | 1989-01-10 | — | — | US | disclosed |