SCHEMBL2116813

SCHEMBL2116813

CCO[Si](CCCCNc1ccccc1)(OCC)OCC

nearest known ligand 0.52

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.52
MAPT P10636 1/20 0.52
KCNH3 Q9ULD8 3/20 0.43
L3MBTL1 Q9Y468 1/20 0.38
EPHX1 P07099 3/20 0.36
HTT P42858 1/20 0.36
CYP1A2 P05177 1/20 0.36
CYP3A4 P08684 1/20 0.36
CYP2C19 P33261 1/20 0.36
ACHE P22303 2/20 0.35
BCHE P06276 1/20 0.35
PTGDR2 Q9Y5Y4 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
HDAC3 O15379 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC2 Q92769 1/20 0.35
NCOR2 Q9Y618 1/20 0.35
SOAT1 P35610 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17766143 0.98 ALDH1A1 (0.50) ALDH1A1MAPTKCNH3L3MBTL1EPHX1
SCHEMBL23361372 0.98 ALDH1A1 (0.50) ALDH1A1MAPTKCNH3L3MBTL1EPHX1
SCHEMBL17766159 0.98 ALDH1A1 (0.50) ALDH1A1MAPTKCNH3L3MBTL1EPHX1
SCHEMBL134305 0.95 ALDH1A1 (0.53) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2
Hydrochloric Acid SCHEMBL29522911 0.93 ALDH1A1 (0.52) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2
SCHEMBL4738119 0.89 ALDH1A1 (0.52) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2
SCHEMBL6441905 0.89 ALDH1A1 (0.47) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2
SCHEMBL16147721 0.89 MAPT (0.47) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2
SCHEMBL554774 0.88 MAPT (0.47) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2
SCHEMBL31687706 0.87 ALDH1A1 (0.48) ALDH1A1MAPTKCNH3L3MBTL1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4738010-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2026-02-10 US disclosed
US-12534399-B2 Laminate and manufacturing method of semiconductor device TORAY INDUSTRIES, INC. (JP) 2026-01-27 US disclosed
EP-4668018-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE Toray Industries, Inc. (JP) 2025-12-24 EP disclosed
US-20250197634-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME TORAY INDUSTRIES, INC. (JP) 2025-06-19 US disclosed
US-20250164880-A1 RESIN COMPOSITION, RESIN COMPOSITION FILM AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS TORAY INDUSTRIES, INC. (JP) 2025-05-22 US disclosed
WO-2025063041-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT USING SAME 東レ株式会社 2025-03-27 WO disclosed
EP-4498158-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME Toray Industries, Inc. (JP) 2025-01-29 EP disclosed
WO-2025004924-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME 東レ株式会社 2025-01-02 WO disclosed
WO-2025004697-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE 東レ株式会社 2025-01-02 WO disclosed
CN-103467507-A Organoxysilane compounds having silyl-protected secondary amino group and making method SHINETSU CHEMICAL CO 2013-12-25 CN disclosed
US-20130296593-A1 ORGANOXYSILANE COMPOUNDS HAVING SILYL-PROTECTED SECONDARY AMINO GROUP AND MAKING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-11-07 US disclosed
EP-2660244-A1 Organoxysilane compounds having silyl-protected secondary amino group and making method Shin-Etsu Chemical Co., Ltd. (JP) 2013-11-06 EP disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 EP disclosed
EP-2520977-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2012-11-07 EP disclosed
US-20120251949-A1 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2012-10-04 US disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device ASIC1, ASIC3, TET3 ALDH1A1 3308/4885MAPT 2947/4885KCNH3 790/4885
US-20130296593-A1 ORGANOXYSILANE COMPOUNDS HAVING SILYL-PROTECTED SECONDARY AMINO GROUP AND MAKING METHOD AS3MT, SUGT1, PNMT ALDH1A1 2214/4885MAPT 231/4885KCNH3 3967/4885
US-12534399-B2 Laminate and manufacturing method of semiconductor device LCP1, CDH1, L1CAM ALDH1A1 1225/4885MAPT 569/4885KCNH3 3858/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.