Sulfamate

Sulfamate

SCHEMBL5147247

NS(=O)(=O)O.[Ni].[Ni]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfamate SCHEMBL42731 1.00
Sulfamate SCHEMBL10905336 0.95 CA1 (0.80)
Sulfamate SCHEMBL4632671 0.95
Sulfamate SCHEMBL28093273 0.95
Sulfamate SCHEMBL502342 0.95 CA1 (0.80)
Sulfamate SCHEMBL432801 0.95 CA1 (0.80)
Sulfamate SCHEMBL6746229 0.95
Sulfamate SCHEMBL11895110 0.95
Sulfamate SCHEMBL15843606 0.95
Sulfamate SCHEMBL27592066 0.95

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119121335-A Additive for diamond wire composite electroplating second-phase particles, electroplating solution containing additive and preparation method of electroplating solution 杨凌美畅新材料股份有限公司 2024-12-13 CN claimed
CN-112192459-B Preparation process of diamond wire saw suitable for cutting large-size semiconductor 苏州韦度新材料科技有限公司 2022-06-28 CN claimed
CN-110438550-B Preparation method of ultra-sharp diamond wire saw and diamond wire saw 苏州韦度新材料科技有限公司 2021-07-09 CN claimed
CN-112993125-A Processing technology for packaging large-angle LED bracket 盐城东山精密制造有限公司 2021-06-18 CN claimed
CN-112192459-A Preparation process of diamond wire saw suitable for cutting large-size semiconductor 苏州韦度新材料科技有限公司 2021-01-08 CN claimed
CN-110106702-A Flame-retardant conductive fabric and preparation method thereof 安徽省通信产业服务有限公司 2019-08-09 CN claimed
CN-104047041-B Preparation method for printed circuit board 深圳市九和咏精密电路有限公司 2017-04-26 CN claimed
CN-104152973-A Method for manufacturing diamond cutting wire QINGDAO GAOXIAO MEASUREMENT & CONTROL TECHNOLOGY CO LTD 2014-11-19 CN claimed
CN-102817232-B Preparation method for electricity conductive cloth, and electricity conductive cloth SHENZHEN FRD SCIENCE & TECHNOLOGY CO LTD 2014-06-18 CN claimed
CN-102817232-A Preparation method for electricity conductive cloth, and electricity conductive cloth SHENZHEN FRD SCIENCE & TECHNOLOGY CO LTD 2012-12-12 CN claimed
CN-119419026-A Neodymium-iron-boron magnet and nickel-cobalt-phosphorus-molybdenum alloy coating thereof, preparation method and application 天津三环乐喜新材料有限公司 2025-02-11 CN disclosed
US-12017297-B2 Method for manufacturing metal matrix composite parts SPIRIT AEROSYSTEMS, INC. (US) 2024-06-25 US disclosed
CN-115747907-B Multifunctional composite electroplated layer of optocoupler lead frame and preparation method 江门市鼎翔电子科技有限公司 2023-11-07 CN disclosed
CN-115532303-B Composite carrier hydrogenation catalyst and application thereof in catalytic color reduction of polytetramethylene ether glycol 杭州三隆新材料有限公司 2023-10-20 CN disclosed
EP-4202073-A1 METHOD FOR MANUFACTURING METAL MATRIX COMPOSITE PARTS Spirit AeroSystems, Inc. (US) 2023-06-28 EP disclosed
EP-0764531-A2 Liquid ejection head, apparatus and recovery method for them CANON KABUSHIKI KAISHA (JP) 1997-03-26 EP disclosed
EP-0761439-A2 Liquid ejecting method, liquid ejecting head, and head cartridge using same CANON KABUSHIKI KAISHA (JP) 1997-03-12 EP disclosed
CN-1136498-A Liquid jet head, liquid jet device and liquid jet method CANON KK (JP) 1996-11-27 CN disclosed
EP-0739737-A2 Liquid ejecting head, liquid ejecting device and liquid ejecting method CANON KABUSHIKI KAISHA (JP) 1996-10-30 EP disclosed
EP-0721842-A2 Liquid ejecting head, liquid ejecting device and liquid ejecting method CANON KABUSHIKI KAISHA (JP) 1996-07-17 EP disclosed