1,2-Naphthoquinone

1,2-Naphthoquinone

SCHEMBL5147399

O=C1C=Cc2ccccc2C1=O.O=S(=O)(Cl)Cl.[N-]=[N+]=N.[N-]=[N+]=[N-]

nearest known ligand 0.65

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPRC P08575 7/20 0.65
IDO1 P14902 3/20 0.65
MEN1 O00255 3/20 0.65
KMT2A Q03164 3/20 0.65
KDM4E B2RXH2 3/20 0.65
PTPN1 P18031 3/20 0.65
CES1 P23141 2/20 0.65
ALDH1A1 P00352 2/20 0.65
MAPT P10636 2/20 0.65
HPGD P15428 2/20 0.65
PTPN22 Q9Y2R2 2/20 0.65
LMNA P02545 1/20 0.65
BCHE P06276 1/20 0.65
POLB P06746 1/20 0.65
THRB P10828 1/20 0.65
PKM P14618 1/20 0.65
ALOX15 P16050 1/20 0.65
ACHE P22303 1/20 0.65
RECQL P46063 1/20 0.65
HSD17B10 Q99714 1/20 0.65

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
1,2-Naphthoquinone SCHEMBL10930514 0.94 PTPRC (0.61) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL203171 0.93 PTPRC (0.74) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL9225610 0.92 PTPRC (0.77) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL9225602 0.88 PTPRC (0.83) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL29368763 0.88 PTPRC (0.83) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL29179724 0.84 PTPRC (0.77) PTPRCIDO1MEN1KMT2AKDM4E
Naphthoquinone SCHEMBL1395610 0.84 IDO1 (0.54) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL20212026 0.84 PTPRC (0.83) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL23780312 0.81 PTPRC (0.71) PTPRCIDO1MEN1KMT2AKDM4E
1,2-Naphthoquinone SCHEMBL8434680 0.81 PTPRC (0.61) PTPRCIDO1MEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6376150-B1 MIXTURE CONTAINING DIAZO RESIN LASTRA S.P.A. (IT) 2002-04-23 US claimed
US-5407780-A High sensitivity, resolution and heat resistance SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-04-18 US claimed
US-5403696-A Mixture of phenolic resin obtained by condensation reaction of formaldehyde with phenol mixture of meta-cresol and 2-tert-butyl-4-methylphenol or 2-tert-butyl-6-methylphenol and 1,2-quinone diazide compound SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-04-04 US claimed
US-5288587-A Novolaks; improved resolution and heat resistance SUMITOMO CHEMICAL CO., LTD. (JP) 1994-02-22 US claimed
US-4292392-A ETCHABLE, DEVELOPABLE AND PERMEABLE USING AN ALKALINE AQUEOUS SOLUTION; CONTRAST FUJI PHOTO FILM CO., LTD. (JP) 1981-09-29 US claimed
JP-60201338-A None JP disclosed
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed
US-11892773-B2 Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-06 US disclosed
EP-4063954-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-04 EP disclosed
EP-3398983-B1 POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS SHINETSU CHEMICAL CO (JP) 2023-09-27 EP disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
CN-111830785-B Resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protecting film, and electronic component 信越化学工业株式会社 2023-08-22 CN disclosed
EP-0443607-A2 Radiation-sensitive positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-08-28 EP disclosed
EP-0435181-A2 Radiation-sensitive positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-07-03 EP disclosed
EP-0422667-A1 Radiation-sensitive positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-04-17 EP disclosed
EP-0416544-A2 Radiation-sensitive positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-03-13 EP disclosed
EP-0415266-A2 Radiation-sensitive positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-03-06 EP disclosed
EP-0384481-A1 Positive photoresist composition and method for formation of resist pattern Chisso Corporation (JP) 1990-08-29 EP disclosed
EP-0358871-A2 Radiation-sensitive positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-03-21 EP disclosed
JP-S60201338-A PHOTODECOMPOSABLE PHOTORESIST MIDORI KAGAKU KENKYUSHO:KK 1985-10-11 JP disclosed