SCHEMBL51711

SCHEMBL51711

CN(C)c1ccc(/C=C2/Cc3ccccc3C2=O)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MAOB P27338 7/20 1.00
MAOA P21397 5/20 1.00
MIF P14174 3/20 0.69
ACHE P22303 3/20 0.67
APP P05067 1/20 0.67
BCHE P06276 1/20 0.67
CYP19A1 P11511 2/20 0.62
TNF P01375 2/20 0.62
ABCB1 P08183 1/20 0.62
PTGS2 P35354 2/20 0.59
KDM4E B2RXH2 2/20 0.59
MEN1 O00255 2/20 0.59
KMT2A Q03164 2/20 0.59
STK17B O94768 1/20 0.58
ALDH1A1 P00352 1/20 0.58
MAPT P10636 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL51712 1.00 MAOB (1.00) MAOBMAOAMIFACHEAPP
SCHEMBL29456881 1.00 MAOB (1.00) MAOBMAOAMIFACHEAPP
SCHEMBL27560521 0.93 MAOB (0.86) MAOBMAOAMIFACHEAPP
SCHEMBL29013399 0.87 MAOB (0.77) MAOBMAOAMIFACHECYP19A1
SCHEMBL8547082 0.87 MAOB (0.77) MAOBMAOAMIFACHECYP19A1
SCHEMBL29546505 0.87 MAOB (0.77) MAOBMAOAMIFACHECYP19A1
SCHEMBL8547081 0.87 MAOB (0.77) MAOBMAOAMIFACHECYP19A1
SCHEMBL14020185 0.85 MAOB (0.74) MAOBMAOAMIFACHEBCHE
SCHEMBL10134148 0.85 MAOB (0.74) MAOBMAOAMIFACHEBCHE
SCHEMBL6681374 0.85 MAOB (0.73) MAOBMAOAMIFACHEBCHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 597 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4743828-A1 PHOTOCURABLE AS WELL AS THERMALLY CURABLE COMPOSITIONS SUITABLE FOR LOW TEMPERATURE CURING BASF SE (DE) 2026-05-20 EP disclosed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
EP-4555025-B1 PHOTOINITIATOR PACKAGE COMPRISING SPECIALISED BISACYLPHOSPHINE OXIDE PHOTOINITIATORS, FURTHER ACYLPHOSPHINE OXIDE PHOTOINITIATORS AND OPTICAL BRIGHTENER SENSITIZERS IGM GROUP B V (NL) 2026-05-13 EP disclosed
EP-3902878-B1 PHOTOINITIATORS IGM RESINS ITALIA SRL (IT) 2026-05-06 EP disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
EP-4534614-B1 PHOTOINITIATOR PACKAGE COMPRISING SPECIALISED BISACYLPHOSPHINE OXIDE PHOTOINITIATORS, FURTHER ACYLPHOSPHINE OXIDE PHOTOINITIATORS AND OPTICAL BRIGHTENER SENSITIZERS IGM GROUP B V (NL) 2026-04-15 EP disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
EP-4722303-A1 PHOTOINITIATOR PACKAGE COMPRISING SPECIALISED BISACYLPHOSPHINE OXIDE PHOTOINITIATORS, FURTHER ACYLPHOSPHINE OXIDE PHOTOINITIATORS AND OPTICAL BRIGHTENER SENSITIZERS IGM Group B.V. (NL) 2026-04-08 EP disclosed
EP-4273200-B1 PHOTOINITIATOR PACKAGE COMPRISING SPECIALISED BISACYLPHOSPHINE OXIDE PHOTOINITIATORS AND OPTICAL BRIGHTENER SENSITIZERS IGM GROUP B V (NL) 2026-03-25 EP disclosed
EP-0560530-A1 Process for forming negative tone images of polyimides for integrated circuit manufacture International Business Machines Corporation (US) 1993-09-15 EP disclosed
US-5238784-A PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER SUMITOMO BAKELITE COMPANY LIMITED (JP) 1993-08-24 US disclosed
EP-0538683-A1 Polyamic acid and polyimide from fluorinated reactant International Business Machines Corporation (US) 1993-04-28 EP disclosed
EP-0531019-A1 Photosensitive polyimide precursor compositions and process for preparing same TORAY INDUSTRIES, INC. (JP) 1993-03-10 EP disclosed
EP-0430220-A2 Photosensitive resin composition and semiconductor apparatus using it SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-06-05 EP disclosed
EP-0430221-A2 Photosensitive resin composition SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-06-05 EP disclosed
EP-0203393-B1 CURABLE COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-07-12 EP disclosed
US-4778859-A Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1988-10-18 US disclosed
EP-0254230-A2 Heat-resistant photoresist film Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1988-01-27 EP disclosed
EP-0203393-A1 Curable composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1986-12-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 MAOB 4827/4885MAOA 4759/4885MIF 1786/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 MAOB 2517/4885MAOA 1350/4885MIF 3042/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.