Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL518262

N.N.[Ti].[W].[W]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140027913-A1 SEMICONDUCTOR STRUCTURES COMPRISING CONDUCTIVE MATERIAL LINING OPENINGS IN AN INSULATIVE MATERIAL MICRON TECHNOLOGY, INC. (US) 2014-01-30 US disclosed
US-8580666-B2 Methods of forming conductive contacts MICRON TECHNOLOGY, INC. (US) 2013-11-12 US disclosed
US-20120025385-A1 Low Resistance Peripheral Local Interconnect Contacts with Selective Wet Strip of Titanium MICRON TECHNOLOGY, INC. 2012-02-02 US disclosed
US-8026542-B2 Low resistance peripheral local interconnect contacts with selective wet strip of titanium MICRON TECHNOLOGY, INC. (US) 2011-09-27 US disclosed
US-7935997-B2 Low resistance peripheral contacts while maintaining DRAM array integrity MICRON TECHNOLOGY, INC. (US) 2011-05-03 US disclosed
US-7605033-B2 Low resistance peripheral local interconnect contacts with selective wet strip of titanium MICRON TECHNOLOGY, INC. (US) 2009-10-20 US disclosed
US-7595521-B2 Terraced film stack MICRON TECHNOLOGY, INC. (US) 2009-09-29 US disclosed
US-20090072288-A1 Terraced Film Stack MICRON SEMICONDUCTOR PRODUCTS, INC. 2009-03-19 US disclosed
US-7473613-B2 Terraced film stack MICRON TECHNOLOGY, INC. (US) 2009-01-06 US disclosed
US-7468533-B2 Terraced film stack MICRON TECHNOLOGY, INC. (US) 2008-12-23 US disclosed
US-7445996-B2 Low resistance peripheral contacts while maintaining DRAM array integrity MICRON TECHNOLOGY, INC. (US) 2008-11-04 US disclosed
US-20070231995-A1 TERRACED FILM STACK MICRON TECHNOLOGY, INC. 2007-10-04 US disclosed
US-7262053-B2 Of a semiconductor device, for example, a DRAM memory device; preparation without creating voids in the fill MICRON TECHNOLOGY, INC. (US) 2007-08-28 US disclosed
US-20070187737-A1 TERRACED FILM STACK MICRON SEMICONDUCTOR PRODUCTS, INC. 2007-08-16 US disclosed
US-20070158749-A1 LOW RESISTANCE PERIPHERAL CONTACTS WHILE MAINTAINING DRAM ARRAY INTEGRITY SPRINGWORKS THERAPEUTICS, INC. 2007-07-12 US disclosed
US-20060289918-A1 Low resistance peripheral local interconnect contacts with selective wet strip of titanium MICRON TECHNOLOGY, INC. (US) 2006-12-28 US disclosed
US-20060286748-A1 Terraced film stack MICRON SEMICONDUCTOR PRODUCTS, INC. 2006-12-21 US disclosed
US-20060205146-A1 Low resistance peripheral contacts while maintaining DRAM array integrity MICRON TECHNOLOGY, INC. 2006-09-14 US disclosed
US-20060046398-A1 Low resistance peripheral local interconnect contacts with selective wet strip of titanium MICRON TECHNOLOGY, INC. (US) 2006-03-02 US disclosed