SCHEMBL5223398

SCHEMBL5223398

C=C(C)C(=O)OC(COc1ccc(C(C)(C)c2ccc(O)cc2)cc1)OCC

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AR P10275 3/20 0.43
HTT P42858 2/20 0.39
HIF1A Q16665 1/20 0.39
LTA4H P09960 1/20 0.38
HSD17B10 Q99714 2/20 0.37
ESR1 P03372 1/20 0.37
CYP3A4 P08684 1/20 0.37
HPGD P15428 1/20 0.37
TSHR P16473 1/20 0.37
SLC6A2 P23975 1/20 0.37
SLC6A4 P31645 1/20 0.37
HTR6 P50406 1/20 0.37
ESRRG P62508 1/20 0.37
SLC6A3 Q01959 1/20 0.37
ESR2 Q92731 1/20 0.37
KDM4E B2RXH2 3/20 0.35
MEN1 O00255 1/20 0.35
GAA P10253 1/20 0.35
KMT2A Q03164 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1468098 0.95 AR (0.46) ARHTTHIF1AHSD17B10KDM4E
SCHEMBL8957781 0.88 AR (0.43) ARHTTHIF1AKDM4EMEN1
SCHEMBL7630191 0.86 AR (0.45) ARHTTHIF1AHSD17B10KDM4E
SCHEMBL8957665 0.85 AR (0.39) ARHTTHIF1AHSD17B10KDM4E
SCHEMBL7625145 0.84 AR (0.39) ARHTTHIF1AHSD17B10KDM4E
SCHEMBL7189264 0.83 MEN1 (0.42) HTTTSHRMEN1GAAKMT2A
SCHEMBL1803446 0.82 MAPT (0.40) HTTKDM4EMEN1KMT2ASMN1; SMN2
SCHEMBL27683333 0.81 MTNR1A (0.44) HTTLTA4HPPARDPOLBTDP1
SCHEMBL4198618 0.80 AR (0.50) ARHTTHIF1AKDM4EMEN1
SCHEMBL30537232 0.80 AR (0.50) ARHTTHIF1AKDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1840654-B1 Radiation-sensitive negative resin composition JSR CORP (JP) 2013-03-20 EP disclosed
EP-1477848-B1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2012-12-05 EP disclosed
US-20070237890-A1 Bilayer Laminated Film for Bump Formation and Method of Bump Formation JSR CORPORATION (JP) 2007-10-11 US disclosed
US-20070231747-A1 Radiation-sensitive negative resin composition JSR CORPORATION (JP) 2007-10-04 US disclosed
EP-1840654-A1 Radiation-sensitive negative resin composition JSR Corporation (JP) 2007-10-03 EP disclosed
US-7265044-B2 Method for forming bump on electrode pad with use of double-layered film JSR CORPORATION (JP) 2007-09-04 US disclosed
EP-1826612-A1 Radiation-sensitive positive resin composition for producing platings, transfer film, and process for producing platings JSR Corporation (JP) 2007-08-29 EP disclosed
US-20070196765-A1 RADIATION-SENSITIVE POSITIVE RESIN COMPOSITION FOR PRODUCING PLATINGS, TRANSFER FILM, AND PROCESS FOR PRODUCING PLATINGS JSR CORPORATION (JP) 2007-08-23 US disclosed
US-7141355-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-11-28 US disclosed
US-20050277245-A1 Method for forming bump on electrode pad with use of double-layered film JSR CORPORATION (JP) 2005-12-15 US disclosed
EP-1542520-A1 METHOD FOR FORMING BUMP ON ELECTRODE PAD WITH USE OF DOUBLE-LAYERED FILM JSR Corporation (JP) 2005-06-15 EP disclosed
EP-1477848-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-11-17 EP disclosed
US-20040142280-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed