SCHEMBL523123

SCHEMBL523123

CN(C)[Si](C)(C)CCc1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TAAR1 Q96RJ0 1/20 0.50
AOC3 Q16853 2/20 0.47
TDP1 Q9NUW8 1/20 0.44
SIGMAR1 Q99720 6/20 0.44
ALDH1A1 P00352 2/20 0.43
TSHR P16473 1/20 0.43
HPGD P15428 1/20 0.41
ALOX15 P16050 1/20 0.41
ALOX12 P18054 1/20 0.41
CASP1 P29466 1/20 0.41
HSD17B10 Q99714 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31154392 0.84 SIGMAR1 (0.56) TAAR1AOC3SIGMAR1
SCHEMBL19130099 0.81 MEN1 (0.49) TAAR1AOC3TDP1SIGMAR1
SCHEMBL1525916 0.80 TAAR1 (0.44) TAAR1AOC3TDP1SIGMAR1ALDH1A1
SCHEMBL8777923 0.77 TSHR (0.46) TAAR1AOC3SIGMAR1ALDH1A1TSHR
SCHEMBL16550634 0.77 TDP1 (0.52) TAAR1AOC3TDP1ALDH1A1HPGD
SCHEMBL3389806 0.77 TDP1 (0.52) TAAR1AOC3TDP1ALDH1A1HPGD
SCHEMBL6420860 0.77 TDP1 (0.52) TAAR1AOC3TDP1ALDH1A1HPGD
SCHEMBL680098 0.73 TDP1 (0.54) TAAR1TDP1ALDH1A1HPGDALOX15
SCHEMBL3624272 0.73 TDP1 (0.48) TAAR1AOC3TDP1ALDH1A1HPGD
SCHEMBL8384979 0.73 TDP1 (0.48) TAAR1AOC3TDP1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110462525-B Surface treatment method and composition for use in the method 富士胶片电子材料美国有限公司 2024-07-26 CN claimed
CN-118344845-A Surface treatment method and composition for use in the method 富士胶片电子材料美国有限公司 2024-07-16 CN claimed
EP-3602606-B1 SURFACE TREATMENT METHODS AND COMPOSITIONS THEREFOR FUJIFILM ELECTRONIC MAT USA INC (US) 2024-06-26 EP claimed
US-10593538-B2 Surface treatment methods and compositions therefor FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2020-03-17 US claimed
EP-3602606-A1 SURFACE TREATMENT METHODS AND COMPOSITIONS THEREFOR FUJIFILM Electronic Materials U.S.A, Inc. (US) 2020-02-05 EP claimed
US-20180277357-A1 SURFACE TREATMENT METHODS AND COMPOSITIONS THEREFOR FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2018-09-27 US claimed
WO-2018175682-A1 SURFACE TREATMENT METHODS AND COMPOSITIONS THEREFOR FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-09-27 WO claimed
WO-2025105151-A1 METHOD OF MANUFACTURING TREATED SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2025-05-22 WO disclosed
CN-110462525-B Surface treatment method and composition for use in the method 富士胶片电子材料美国有限公司 2024-07-26 CN disclosed
CN-118344845-A Surface treatment method and composition for use in the method 富士胶片电子材料美国有限公司 2024-07-16 CN disclosed
EP-3602606-B1 SURFACE TREATMENT METHODS AND COMPOSITIONS THEREFOR FUJIFILM ELECTRONIC MAT USA INC (US) 2024-06-26 EP disclosed
US-11965111-B2 Surface treatment agent and surface treatment method TOKYO OHKA KOGYO CO., LTD. (JP) 2024-04-23 US disclosed
EP-3743464-B1 ORGANIC-INORGANIC AEROGEL COMPOSITES, METHODS AND USES THEREOF BRONX CREATIVE&DESIGN CENTRE PTE LTD (SG) 2024-03-06 EP disclosed
US-7611748-B2 Method for selecting formulations to treat electrical cables NOVINIUM, INC. (US) 2009-11-03 US disclosed
US-20090030222-A1 SYSTEMS AND METHODS FOR FUNCTIONALIZING PARTICULATES WITH SILANE-CONTAINING MATERIALS DOW CORNING CORPORATION 2009-01-29 US disclosed
EP-1979422-A2 SYSTEMS AND METHODS FOR FUNCTIONALIZING PARTICULATES SILANE-CONTAINING MATERIALS Dow Corning Corporation (US) 2008-10-15 EP disclosed
WO-2007084245-A2 SYSTEMS AND METHODS FOR FUNCTIONALIZING PARTICULATES SILANE-CONTAINING MATERIALS DOW CORNING CORPORATION (US) 2007-07-26 WO disclosed
US-20050192708-A1 Method for selecting formulations to treat electrical cables NOVINIUM, INC. (US) 2005-09-01 US disclosed
US-20050189130-A1 Method for treating electrical cable at sustained elevated pressure NOVINIUM, INC. (US) 2005-09-01 US disclosed
WO-2005034205-A2 SELF ASSEMBLING NANOPARTICLE-POLYMER HYBRIDS DOW CORNING CORPORATION (US) 2005-04-14 WO disclosed