SCHEMBL523506

SCHEMBL523506

CC(=O)OC(C)C[SiH](Cl)Cl

nearest known ligand 0.48

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.48
CHRM2 P08172 1/20 0.48
CHRM4 P08173 1/20 0.48
CHRM1 P11229 1/20 0.48
TBXA2R P21731 1/20 0.48
GALR3 O60755 1/20 0.47
MAPT P10636 1/20 0.47
BLM P54132 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
ALOX15 P16050 1/20 0.35
TRPV1 Q8NER1 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3340344 0.76 TSHR (0.47) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL524943 0.74 TSHR (0.36) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL6016861 0.73
SCHEMBL9863022 0.73
SCHEMBL3341334 0.72 TSHR (0.44) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10331178 0.72 TSHR (0.58) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10804192 0.72 TSHR (0.58) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10793944 0.72 TSHR (0.58) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10796086 0.72 TSHR (0.58) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL26183 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024172770-A1 PRINTABLE WAX, METHOD OF PRINTING, AND METHOD FOR FLOW VISCOSITY CONTROL AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) 2024-08-22 WO claimed
US-8039049-B2 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2011-10-18 US claimed
US-7405168-B2 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMITED (JP) 2008-07-29 US claimed
US-20080076262-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2008-03-27 US claimed
US-7345000-B2 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2008-03-18 US claimed
WO-2007040816-A2 TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
WO-2007040856-A2 PLASMA-ASSISTED VAPOR PHASE TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
WO-2007040834-A2 PLURAL TREATMENT STEP PROCESS FOR TREATING DIELECTRIC FILMS TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077353-A1 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077781-A1 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMTED (JP) 2007-04-05 US claimed
WO-2006091264-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2006-08-31 WO claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
CN-111051370-B Amphoteric graft copolymer and medical device having enhanced adhesive strength 贝克顿·迪金森公司 2023-01-06 CN disclosed
US-11198801-B2 Amphiphilic graft copolymers and medical devices with enhanced bond strength BECTON, DICKINSON AND COMPANY (US) 2021-12-14 US disclosed
US-10814040-B2 Laser markable medical devices BECTON, DICKINSON AND COMPANY (US) 2020-10-27 US disclosed
US-20040249103-A1 Silsesquioxane derivatives and process for production thereof JNC CORPORATION (JP) 2004-12-09 US disclosed
US-20040180193-A1 Resin composition, filler, and method of producing resin composition NISSAN MOTOR CO., LTD. 2004-09-16 US disclosed
EP-1457521-A1 Resin composition, filler, and method of producing resin composition NISSAN MOTOR CO., LTD. (JP) 2004-09-15 EP disclosed
EP-1428795-A1 SILSESQUIOXANE DERIVATIVES AND PROCESS FOR PRODUCTION THEREOF CHISSO CORPORATION (JP) 2004-06-16 EP disclosed