SCHEMBL524798

SCHEMBL524798

CCCCCC(C)(C)OOC1(OOC(C)(C)CCCCC)CCC(C(C)(CC)C2CCC(OOC(C)(C)CCCCC)(OOC(C)(C)CCCCC)CC2)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL524064 0.89
SCHEMBL3402326 0.83 CYP1A2 (0.32)
SCHEMBL3281413 0.81
SCHEMBL29402351 0.81 CNR2 (0.30)
SCHEMBL524905 0.80
SCHEMBL9625881 0.79
SCHEMBL3284303 0.78
SCHEMBL9084303 0.77 MAPK1 (0.36)
SCHEMBL524898 0.74
SCHEMBL11868458 0.74 CNR1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230407054-A1 RESIN COMPOSITION, METHOD OF PRODUCING RESIN COMPOSITION, AND RESIN TOAGOSEI CO., LTD. (JP) 2023-12-21 US disclosed
WO-2023195378-A1 CHAIN TRANSFER AGENT, PRODUCTION METHOD OF POLYMER, POLYMER, PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND POLYMER PARTICLES 国立大学法人信州大学 2023-10-12 WO disclosed
WO-2022259783-A1 CURABLE COMPOSITION AND CURED PRODUCT 綜研化学株式会社 2022-12-15 WO disclosed
WO-2022259815-A1 CURABLE COMPOSITION AND CURED PRODUCT 綜研化学株式会社 2022-12-15 WO disclosed
WO-2022259816-A1 CURABLE COMPOSITION, CURED PRODUCT, AND TWO-PART CURABLE COMPOSITION 綜研化学株式会社 2022-12-15 WO disclosed
US-20220372350-A1 Adhesive Composition for Decorative Film SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2022-11-24 US disclosed
WO-2022185715-A1 ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND OPTICAL MEMBER 綜研化学株式会社 2022-09-09 WO disclosed
EP-4029693-A1 ADHESIVE COMPOSITION FOR DECORATIVE FILM Soken Chemical & Engineering Co., Ltd. (JP) 2022-07-20 EP disclosed
EP-2397533-B1 RADIATION CURABLE ADHESIVE COMPOSITION FOR OPTICAL COMPONENTS AND ADHESIVE OPTICAL COMPONENT SOKEN KAGAKU KK (JP) 2013-04-17 EP disclosed
US-20120028041-A1 Radiation-Curable Adhesive Composition for Optical Component and Adhesive Optical Component SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2012-02-02 US disclosed
EP-1262838-A1 RESIN COMPOSITION FOR TONER AND TONER Mitsui Chemicals, Inc. (JP) 2002-12-04 EP disclosed
EP-0756208-B1 Resin composition for electrophotographic toner, and toner comprising it MITSUI CHEMICALS INC (JP) 2001-04-11 EP disclosed
US-6011119-A RESIN COMPOSITION SHOWS EXCELLENT CHARGING CHARACTERISTICS WITHOUT A CHARGE CONTROL AGENT; HIGH AND LOW MOLECULAR WEIGHT ADDITION POLYMERS AT LEAST ONE OF WHICH IS FROM AN UNSATURATED ANHYDRIDE AND AN ACRYLOYLOXYALKYL DICARBOXYLIC ACID ESTER MITSUI CHEMICALS, INC. (JP) 2000-01-04 US disclosed
EP-0568309-B1 Resin composition for electrophotographic toner MITSUI TOATSU CHEMICALS (JP) 1997-07-16 EP disclosed
EP-0756208-A1 Resin composition for electrophotographic toner, and toner comprising it MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1997-01-29 EP disclosed
US-5502110-A ADDITION POLYMER BLENDS PREPARED WITH MULTIFUNCTIONAL PEROXIDE INITIATORS MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1996-03-26 US disclosed
EP-0568309-A2 Resin composition for electrophotographic toner MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-11-03 EP disclosed
US-5254650-A Using tetrafunctional peroxide; heat resistance, radiation transparent, discoloration inhibition KAYAKU AKZO CORPORATION (JP) 1993-10-19 US disclosed
EP-0351929-B1 PROCESS FOR THE PREPARATION OF STYRENE OR STYRENE DERIVATIVE-CONTAINING COPOLYMERS KAYAKU AKZO CORPORATION (JP) 1993-03-10 EP disclosed
EP-0351929-A2 Process for the preparation of styrene or styrene derivative-containing copolymers KAYAKU AKZO CORPORATION (JP) 1990-01-24 EP disclosed