SCHEMBL524898

SCHEMBL524898

CCC(C)(C)OOC1(OOC(C)(C)CC)CCC(C(C)(C)C2CCC(OOC(C)(C)CC)(OOC(C)(C)CC)CC2)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3284303 0.86
SCHEMBL597502 0.84
SCHEMBL524064 0.82
SCHEMBL94699 0.80 ALDH1A1 (0.30)
SCHEMBL3408975 0.80 ALDH1A1 (0.31)
SCHEMBL25095541 0.77
SCHEMBL11588625 0.76 ALDH1A1 (0.33)
SCHEMBL23162 0.76 ALDH1A1 (0.33)
SCHEMBL3281413 0.76
SCHEMBL3284305 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0501288-B1 Process for producing styrenic polymer IDEMITSU PETROCHEMICAL CO (JP) 1996-08-14 EP claimed
US-5191040-A Peroxide catalyst IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1993-03-02 US claimed
EP-0501288-A1 Process for producing styrenic polymer IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1992-09-02 EP claimed
WO-2024135173-A1 RESIN COMPOSITION FOR POWDER COATING MATERIAL, POWDER COATING MATERIAL, AND ARTICLE HAVING COATING FILM FORMED OF SAID COATING MATERIAL DIC株式会社 2024-06-27 WO disclosed
WO-2024127899-A1 RESIN COMPOSITION FOR POWDER COATING MATERIALS, POWDER COATING MATERIAL, AND ARTICLE HAVING COATING FILM OF SAID POWDER COATING MATERIAL DIC株式会社 2024-06-20 WO disclosed
EP-4353758-A1 RESIN COMPOSITION, COATING MATERIAL, AND COATED ARTICLE DIC Corporation (JP) 2024-04-17 EP disclosed
CN-117736498-A Colored organic peroxide compositions 阿科玛股份有限公司 2024-03-22 CN disclosed
WO-2024042892-A1 ADHESIVE COMPOSITION AND OPTICAL LAMINATED BODY WITH ADHESIVE LAYER 綜研化学株式会社 2024-02-29 WO disclosed
WO-2024014394-A1 ADHESIVE LAYER-BEARING POLARIZING FILM AND IMAGE DISPLAY DEVICE 綜研化学株式会社 2024-01-18 WO disclosed
WO-2024004421-A1 RESIN COMPOSITION FOR POWDER COATING MATERIAL, POWDER COATING MATERIAL, AND ARTICLE HAVING COATING FILM OF SAID POWDER COATING MATERIAL DIC株式会社 2024-01-04 WO disclosed
US-20230407054-A1 RESIN COMPOSITION, METHOD OF PRODUCING RESIN COMPOSITION, AND RESIN TOAGOSEI CO., LTD. (JP) 2023-12-21 US disclosed
EP-0733074-B1 PROCESS FOR PRODUCING HIGH MOLECULAR WEIGHT MONOVINYLIDENE AROMATIC POLYMERS DOW CHEMICAL CO (US) 1999-06-16 EP disclosed
EP-0756208-A1 Resin composition for electrophotographic toner, and toner comprising it MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1997-01-29 EP disclosed
US-5502110-A ADDITION POLYMER BLENDS PREPARED WITH MULTIFUNCTIONAL PEROXIDE INITIATORS MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1996-03-26 US disclosed
US-5455321-A Using free radical initiator and organic gel reduction agent, such as mercaptans; recycle liquid generated by devolatization of polymer mixture THE DOW CHEMICAL COMPANY (US) 1995-10-03 US disclosed
EP-0568309-A2 Resin composition for electrophotographic toner MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-11-03 EP disclosed
US-5254650-A Using tetrafunctional peroxide; heat resistance, radiation transparent, discoloration inhibition KAYAKU AKZO CORPORATION (JP) 1993-10-19 US disclosed
EP-0351929-B1 PROCESS FOR THE PREPARATION OF STYRENE OR STYRENE DERIVATIVE-CONTAINING COPOLYMERS KAYAKU AKZO CORPORATION (JP) 1993-03-10 EP disclosed
US-5191040-A Peroxide catalyst IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1993-03-02 US disclosed
EP-0351929-A2 Process for the preparation of styrene or styrene derivative-containing copolymers KAYAKU AKZO CORPORATION (JP) 1990-01-24 EP disclosed