SCHEMBL524064

SCHEMBL524064

CCCCCC(C)(C)OOC1(OOC(C)(C)CCCCC)CCC(C(C)(C)C2CCC(OOC(C)(C)CCCCC)(OOC(C)(C)CCCCC)CC2)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL524798 0.89
SCHEMBL3284303 0.89
SCHEMBL9084303 0.86 MAPK1 (0.36)
SCHEMBL3402326 0.84 CYP1A2 (0.32)
SCHEMBL524898 0.82
SCHEMBL9625881 0.80
SCHEMBL29402351 0.79 CNR2 (0.30)
SCHEMBL25095541 0.77
SCHEMBL465157 0.76 SMN1; SMN2 (0.31)
SCHEMBL11868458 0.75 CNR1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024042892-A1 ADHESIVE COMPOSITION AND OPTICAL LAMINATED BODY WITH ADHESIVE LAYER 綜研化学株式会社 2024-02-29 WO disclosed
WO-2024014394-A1 ADHESIVE LAYER-BEARING POLARIZING FILM AND IMAGE DISPLAY DEVICE 綜研化学株式会社 2024-01-18 WO disclosed
US-20230407054-A1 RESIN COMPOSITION, METHOD OF PRODUCING RESIN COMPOSITION, AND RESIN TOAGOSEI CO., LTD. (JP) 2023-12-21 US disclosed
WO-2023195378-A1 CHAIN TRANSFER AGENT, PRODUCTION METHOD OF POLYMER, POLYMER, PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND POLYMER PARTICLES 国立大学法人信州大学 2023-10-12 WO disclosed
EP-4245428-A1 PUTTY COATING COMPOSITION Nippon Paint Industrial Coatings Co., Ltd. (JP) 2023-09-20 EP disclosed
US-20230265319-A1 Adhesive Composition and Adhesive Sheet SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2023-08-24 US disclosed
WO-2023136052-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR POLARIZING PLATE, AND POLARIZING PLATE WITH PRESSURE-SENSITIVE ADHESIVE LAYER 綜研化学株式会社 2023-07-20 WO disclosed
EP-4183849-A1 ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET Soken Chemical & Engineering Co., Ltd. (JP) 2023-05-24 EP disclosed
WO-2022259815-A1 CURABLE COMPOSITION AND CURED PRODUCT 綜研化学株式会社 2022-12-15 WO disclosed
WO-2022259816-A1 CURABLE COMPOSITION, CURED PRODUCT, AND TWO-PART CURABLE COMPOSITION 綜研化学株式会社 2022-12-15 WO disclosed
US-20030022990-A1 Aromatic vinyl polymer resin composition and its molding IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-01-30 US disclosed
EP-1262838-A1 RESIN COMPOSITION FOR TONER AND TONER Mitsui Chemicals, Inc. (JP) 2002-12-04 EP disclosed
EP-1229058-A1 RUBBER-MODIFIED STYRENE RESIN, PROCESS FOR PRODUCING THE SAME, AND SHEET OF THE RESIN IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2002-08-07 EP disclosed
EP-0756208-B1 Resin composition for electrophotographic toner, and toner comprising it MITSUI CHEMICALS INC (JP) 2001-04-11 EP disclosed
US-6011119-A RESIN COMPOSITION SHOWS EXCELLENT CHARGING CHARACTERISTICS WITHOUT A CHARGE CONTROL AGENT; HIGH AND LOW MOLECULAR WEIGHT ADDITION POLYMERS AT LEAST ONE OF WHICH IS FROM AN UNSATURATED ANHYDRIDE AND AN ACRYLOYLOXYALKYL DICARBOXYLIC ACID ESTER MITSUI CHEMICALS, INC. (JP) 2000-01-04 US disclosed
EP-0568309-B1 Resin composition for electrophotographic toner MITSUI TOATSU CHEMICALS (JP) 1997-07-16 EP disclosed
EP-0756208-A1 Resin composition for electrophotographic toner, and toner comprising it MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1997-01-29 EP disclosed
US-5254650-A Using tetrafunctional peroxide; heat resistance, radiation transparent, discoloration inhibition KAYAKU AKZO CORPORATION (JP) 1993-10-19 US disclosed
EP-0351929-B1 PROCESS FOR THE PREPARATION OF STYRENE OR STYRENE DERIVATIVE-CONTAINING COPOLYMERS KAYAKU AKZO CORPORATION (JP) 1993-03-10 EP disclosed
EP-0351929-A2 Process for the preparation of styrene or styrene derivative-containing copolymers KAYAKU AKZO CORPORATION (JP) 1990-01-24 EP disclosed