SCHEMBL526402

SCHEMBL526402

CCCCCCCCCCCCCCCCCCC(CCCCCCCCCCCCCCCCCC)(O[PH](=O)O)c1cc(C(C)(C)C)cc(C(C)(C)C)c1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 9/20 0.38
CNR1 P21554 8/20 0.38
GGPS1 O95749 2/20 0.35
HDAC3 O15379 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC2 Q92769 1/20 0.35
STS P08842 2/20 0.34
RXRA P19793 1/20 0.34
RXRB P28702 1/20 0.34
RXRG P48443 1/20 0.34
KDM4E B2RXH2 1/20 0.34
TP53 P04637 1/20 0.34
CYP3A4 P08684 1/20 0.34
MAPT P10636 1/20 0.34
ALOX15 P16050 1/20 0.34
TSHR P16473 1/20 0.34
ACAT1 P24752 1/20 0.34
SOAT1 P35610 1/20 0.34
NR5A2 O00482 1/20 0.33
NR5A1 Q13285 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98335 0.86 NR5A2 (0.40) CNR2CNR1CYP3A4MAPTTSHR
SCHEMBL697804 0.83 CYP1A2 (0.39) CNR2CNR1NR5A2NR5A1
SCHEMBL9517481 0.80 ALOX5 (0.40) CNR2CNR1GGPS1TP53CYP3A4
SCHEMBL11408194 0.80 GAA (0.38) CNR2CNR1GGPS1TSHR
SCHEMBL11423200 0.79 KIF11 (0.38) GGPS1TSHR
SCHEMBL30738560 0.73 CYP1A2 (0.38) CNR2CNR1NR5A2NR5A1
SCHEMBL8048646 0.73 CNR1 (0.35) CNR2CNR1
SCHEMBL11803252 0.73 CNR1 (0.42) CNR2CNR1
SCHEMBL11805620 0.73 CNR1 (0.42) CNR2CNR1
SCHEMBL17822661 0.73 GGPS1 (0.44) GGPS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240228837-A1 HOT MELT ADHESIVES AND USES THEREOF HENKEL AG & CO KGAA (DE) 2024-07-11 US disclosed
US-11970635-B2 Hot melt adhesives and uses thereof HENKEL AG & CO. KGAA (DE) 2024-04-30 US disclosed
US-20230066070-A1 HOT MELT ADHESIVES AND USES THEREOF HENKEL AG & CO. KGAA (DE) 2023-03-02 US disclosed
EP-3283592-B1 HOT MELT ADHESIVES AND USES THEREOF Henkel IP & Holding GmbH (DE) 2022-08-03 EP disclosed
EP-2958970-B1 ELASTIC ATTACHMENT ADHESIVE AND USE THEREOF Henkel IP & Holding GmbH (DE) 2022-06-01 EP disclosed
EP-3417030-A1 NANOCRYSTAL EPOXY THIOL COMPOSITE MATERIAL AND NANOCRYSTAL EPOXY THIOL COMPOSITE FILM Henkel AG & Co. KGaA (DE) 2018-12-26 EP disclosed
US-20180346809-A1 NANOCRYSTAL EPOXY THIOL COMPOSITE MATERIAL AND NANOCRYSTAL EPOXY THIOL COMPOSITE FILM HENKEL AG & CO KGAA (DE) 2018-12-06 US disclosed
EP-3283592-A1 HOT MELT ADHESIVES AND USES THEREOF Henkel IP & Holding GmbH (DE) 2018-02-21 EP disclosed
US-20180037777-A1 HOT MELT ADHESIVES AND USES THEREOF HENKEL AG & CO. KGAA (DE) 2018-02-08 US disclosed
WO-2017140491-A1 NANOCRYSTAL EPOXY THIOL COMPOSITE MATERIAL AND NANOCRYSTAL EPOXY THIOL COMPOSITE FILM HENKEL AG & CO. KGAA (DE) 2017-08-24 WO disclosed
EP-2970723-A1 ADHESIVE COMPOSITIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF Henkel IP & Holding GmbH (DE) 2016-01-20 EP disclosed
EP-2958970-A1 ELASTIC ATTACHMENT ADHESIVE AND USE THEREOF Henkel IP & Holding GmbH (DE) 2015-12-30 EP disclosed
WO-2014163758-A1 ADHESIVE COMPOSITIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF Henkel US IP LLC (US) 2014-10-09 WO disclosed
US-20140272214-A1 ADHESIVE COMPOSTIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF HENKEL LTD. (GB) 2014-09-18 US disclosed
WO-2014130180-A1 ELASTIC ATTACHMENT ADHESIVE AND USE THEREOF Henkel US IP LLC (US) 2014-08-28 WO disclosed
US-20140235127-A1 ELASTIC ATTACHMENT ADHESIVE AND USE THEREOF HENKEL CORPORATION (US) 2014-08-21 US disclosed
US-8669322-B2 Process for manufacturing an adhesive by means of extrusion HENKEL AG & CO. KGAA (DE) 2014-03-11 US disclosed
EP-2598308-A1 PROCESS FOR MANUFACTURING AN ADHESIVE BY MEANS OF EXTRUSION Henkel AG & Co. KGaA (DE) 2013-06-05 EP disclosed
US-20130137794-A1 PROCESS FOR MANUFACTURING AN ADHESIVE BY MEANS OF EXTRUSION HENKEL AG & CO. KGAA (DE) 2013-05-30 US disclosed
WO-2012013699-A1 PROCESS FOR MANUFACTURING AN ADHESIVE BY MEANS OF EXTRUSION HENKEL AG & CO. KGAA (DE) 2012-02-02 WO disclosed