SCHEMBL5267993

SCHEMBL5267993

CCCCCCCCCCCCOC(O)COCCO

nearest known ligand 0.57

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.57
MEN1 O00255 1/20 0.57
THRB P10828 1/20 0.57
KMT2A Q03164 1/20 0.57
MAPT P10636 1/20 0.57
USP2 O75604 1/20 0.55
TSHR P16473 1/20 0.47
LPAR1 Q92633 5/20 0.45
LPAR3 Q9UBY5 5/20 0.45
LPAR2 Q9HBW0 2/20 0.45
SPHK1 Q9NYA1 1/20 0.45
LPAR5 Q9H1C0 2/20 0.42
DNM1 Q05193 1/20 0.40
TLR2 O60603 1/20 0.39
PLA2G2C Q5R387 1/20 0.39
LPAR6 P43657 1/20 0.39
LPAR4 Q99677 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2730257 1.00 HTT (0.57) HTTMEN1THRBKMT2AMAPT
SCHEMBL11436367 0.98 HTT (0.53) HTTMEN1THRBKMT2AMAPT
SCHEMBL5270551 0.96 MEN1 (0.63) HTTMEN1THRBKMT2AMAPT
SCHEMBL5265746 0.96 MEN1 (0.63) HTTMEN1THRBKMT2AMAPT
SCHEMBL6269869 0.95 MEN1 (0.60) HTTMEN1THRBKMT2AMAPT
SCHEMBL472216 0.92 TSHR (0.56) HTTMEN1THRBKMT2AMAPT
SCHEMBL31122629 0.90 USP2 (0.60) HTTMEN1THRBKMT2AMAPT
SCHEMBL11436017 0.89 TSHR (0.57) HTTMEN1THRBKMT2AMAPT
SCHEMBL212883 0.89 TSHR (0.57) HTTMEN1THRBKMT2AMAPT
SCHEMBL1575700 0.89 TSHR (0.57) HTTMEN1THRBKMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240118612-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2024-04-11 US disclosed
US-10415011-B2 Adherend recovery method, adherend recovery apparatus, gas-generating film and resin composition JSR CORPORATION (JP) 2019-09-17 US disclosed
EP-3040411-B1 ADHEREND RECOVERY METHOD AND ADHEREND RECOVERY DEVICE JSR CORP (JP) 2019-07-03 EP disclosed
US-10095110-B2 Photosensitive resin composition, method for forming resist pattern, and method for producing metallic pattern JSR CORPORATION (JP) 2018-10-09 US disclosed
US-20170153543-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING METALLIC PATTERN JSR CORPORATION (JP) 2017-06-01 US disclosed
US-20170127533-A1 PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAMINATE, LAMINATE AND ELECTRONIC PART JSR CORPORATION (JP) 2017-05-04 US disclosed
EP-3040411-A1 ADHEREND RECOVERY METHOD, ADHEREND RECOVERY DEVICE, GAS GENERATION MEMBRANE, AND RESIN COMPOSITION JSR Corporation (JP) 2016-07-06 EP disclosed
US-20160168532-A1 ADHEREND RECOVERY METHOD, ADHEREND RECOVERY APPARATUS, GAS-GENERATING FILM AND RESIN COMPOSITION JSR CORPORATION (JP) 2016-06-16 US disclosed
EP-1840654-B1 Radiation-sensitive negative resin composition JSR CORP (JP) 2013-03-20 EP disclosed
EP-1840654-A1 Radiation-sensitive negative resin composition JSR Corporation (JP) 2007-10-03 EP disclosed