SCHEMBL5270551

SCHEMBL5270551

CCCCCCCCCCCCOC(O)COCCOCCOCCO

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.63
KMT2A Q03164 3/20 0.63
HTT P42858 2/20 0.63
THRB P10828 1/20 0.63
MAPT P10636 1/20 0.63
USP2 O75604 2/20 0.51
TSHR P16473 1/20 0.48
LPAR1 Q92633 4/20 0.43
LPAR3 Q9UBY5 4/20 0.43
LPAR2 Q9HBW0 1/20 0.43
SPHK1 Q9NYA1 1/20 0.42
ALDH1A1 P00352 1/20 0.41
LMNA P02545 1/20 0.41
CYP3A4 P08684 1/20 0.41
MAPK1 P28482 1/20 0.41
CASP1 P29466 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
SLCO1B3 Q9NPD5 1/20 0.41
SLCO1B1 Q9Y6L6 1/20 0.41
LPAR5 Q9H1C0 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5265746 1.00 MEN1 (0.63) MEN1KMT2AHTTTHRBMAPT
SCHEMBL6269869 0.98 MEN1 (0.60) MEN1KMT2AHTTTHRBMAPT
SCHEMBL2730257 0.96 HTT (0.57) MEN1KMT2AHTTTHRBMAPT
SCHEMBL5267993 0.96 HTT (0.57) MEN1KMT2AHTTTHRBMAPT
SCHEMBL11436367 0.95 HTT (0.53) MEN1KMT2AHTTTHRBMAPT
SCHEMBL11436017 0.93 TSHR (0.57) MEN1KMT2AHTTTHRBMAPT
SCHEMBL6544683 0.93 TSHR (0.57) MEN1KMT2AHTTTHRBMAPT
SCHEMBL1575700 0.93 TSHR (0.57) MEN1KMT2AHTTTHRBMAPT
SCHEMBL212883 0.93 TSHR (0.57) MEN1KMT2AHTTTHRBMAPT
SCHEMBL472216 0.89 TSHR (0.56) MEN1KMT2AHTTTHRBMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240118612-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2024-04-11 US disclosed
JP-2022053156-A COSMETICS CONTAINING CERAMIDE-CONTAINING NIOSOME 株式会社ファンケル 2022-04-05 JP disclosed
US-20210311391-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED FORMED BODY, AND SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2021-10-07 US disclosed
WO-2020039755-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED FORMED BODY, AND SEMICONDUCTOR DEVICE JSR株式会社 2020-02-27 WO disclosed
US-10415011-B2 Adherend recovery method, adherend recovery apparatus, gas-generating film and resin composition JSR CORPORATION (JP) 2019-09-17 US disclosed
EP-3040411-B1 ADHEREND RECOVERY METHOD AND ADHEREND RECOVERY DEVICE JSR CORP (JP) 2019-07-03 EP disclosed
US-10095110-B2 Photosensitive resin composition, method for forming resist pattern, and method for producing metallic pattern JSR CORPORATION (JP) 2018-10-09 US disclosed
US-20170153543-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING METALLIC PATTERN JSR CORPORATION (JP) 2017-06-01 US disclosed
US-20170127533-A1 PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAMINATE, LAMINATE AND ELECTRONIC PART JSR CORPORATION (JP) 2017-05-04 US disclosed
EP-3040411-A1 ADHEREND RECOVERY METHOD, ADHEREND RECOVERY DEVICE, GAS GENERATION MEMBRANE, AND RESIN COMPOSITION JSR Corporation (JP) 2016-07-06 EP disclosed
US-20160168532-A1 ADHEREND RECOVERY METHOD, ADHEREND RECOVERY APPARATUS, GAS-GENERATING FILM AND RESIN COMPOSITION JSR CORPORATION (JP) 2016-06-16 US disclosed
EP-1840654-B1 Radiation-sensitive negative resin composition JSR CORP (JP) 2013-03-20 EP disclosed
EP-1840654-A1 Radiation-sensitive negative resin composition JSR Corporation (JP) 2007-10-03 EP disclosed