Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 1/20 | 0.47 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.47 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.43 |
| ▸ | PTGES | O14684 | 1/20 | 0.43 |
| ▸ | PPARG | P37231 | 1/20 | 0.43 |
| ▸ | RECQL | P46063 | 1/20 | 0.43 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.41 |
| ▸ | APEX1 | P27695 | 6/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | THRB | P10828 | 1/20 | 0.40 |
| ▸ | MEN1 | O00255 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | MME | P08473 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2010386 | 0.89 | RECQL (0.41) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL1786246 | 0.78 | ALOX5 (0.59) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL524132 | 0.78 | ALOX5 (0.59) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL524131 | 0.78 | ALOX5 (0.59) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL8702152 | 0.78 | ALOX5 (0.59) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL83534 | 0.78 | CYP3A4 (0.49) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL6298571 | 0.76 | CYP3A4 (0.54) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL17629135 | 0.76 | LMNA (0.66) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL17629136 | 0.76 | LMNA (0.66) | CYP3A4CYP2C9ALOX5PTGESPPARG | |
| SCHEMBL28271475 | 0.76 | LMNA (0.66) | CYP3A4CYP2C9ALOX5PTGESPPARG |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | claimed |
| EP-0896502-B1 | Method of treating metal foil for enhancing adhesion | NIKKO MATERIALS USA INC (US) | 2007-10-03 | — | — | EP | disclosed |
| EP-0974685-B1 | Method for making a metal foil with improved bonding to substrates | GA TEK INC (US) | 2003-12-03 | — | — | EP | disclosed |
| EP-1089866-A4 | PROCESS TO PREPARE A POLYMER NANOCOMPOSITE COMPOSITION | SOLUTIA INC (US) | 2002-09-25 | — | — | EP | disclosed |
| EP-1214356-A1 | METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU POLYMERIZATION | Solutia Inc. (US) | 2002-06-19 | — | — | EP | disclosed |
| EP-1054922-A4 | POLYMER NANOCOMPOSITE COMPOSITION | SOLUTIA INC (US) | 2001-08-08 | — | — | EP | disclosed |
| EP-1089866-A1 | PROCESS TO PREPARE A POLYMER NANOCOMPOSITE COMPOSITION | Solutia Inc. (US) | 2001-04-11 | — | — | EP | disclosed |
| EP-1086144-A1 | METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU AND SOLID STATE POLYMERIZATIONS | Solutia Inc. (US) | 2001-03-28 | — | — | EP | disclosed |
| WO-2001012678-A1 | METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU POLYMERIZATION | SOLUTIA INC. (US) | 2001-02-22 | — | — | WO | disclosed |
| EP-1054922-A1 | POLYMER NANOCOMPOSITE COMPOSITION | Solutia Inc. (US) | 2000-11-29 | — | — | EP | disclosed |
| US-6086743-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS, INC. (US) | 2000-07-11 | — | — | US | disclosed |
| WO-2000009571-A1 | METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU AND SOLID STATE POLYMERIZATIONS | SOLUTIA INC. (US) | 2000-02-24 | — | — | WO | disclosed |
| EP-0974685-A1 | Metal foil with improved bonding to substrates and method for making said foil | Gould Electronics Inc. (US) | 2000-01-26 | — | — | EP | disclosed |
| WO-1999041060-A1 | PROCESS TO PREPARE A POLYMER NANOCOMPOSITE COMPOSITION | SOLUTIA, INC. (US) | 1999-08-19 | — | — | WO | disclosed |
| WO-1999041299-A1 | POLYMER NANOCOMPOSITE COMPOSITION | SOLUTIA INC. (US) | 1999-08-19 | — | — | WO | disclosed |
| US-5908542-A | CONTACTING A METAL FOIL WITH AN ACIDIC SOLUTION; PLACING THE METAL FOIL IN A NICKEL TREATMENT BATH AND APPLYING A CURRENT THROUGH THE NICKEL TREATMENT BATH, WHEREIN THE NICKEL TREATMENT BATH CONTAINS AT LEAST ABOUT TWO PLATING ZONES, | GOULD ELECTRONICS INC. (US) | 1999-06-01 | — | — | US | disclosed |
| US-5885436-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS INC. (US) | 1999-03-23 | — | — | US | disclosed |
| EP-0896502-A1 | Method of treating metal foil for enhancing adhesion | Gould Electronics Inc. (US) | 1999-02-10 | — | — | EP | disclosed |