SCHEMBL5277149

SCHEMBL5277149

CCC1(CC)N=NN=N1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29634281 0.84
SCHEMBL5277696 0.81
SCHEMBL3816629 0.76 LMNA (0.30)
SCHEMBL5278065 0.76
SCHEMBL5281313 0.74 TSHR (0.33)
SCHEMBL5279329 0.73 TSHR (0.38)
SCHEMBL5275637 0.72
SCHEMBL5281079 0.67 TSHR (0.33)
SCHEMBL3820595 0.67
SCHEMBL5277353 0.65 TSHR (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104120427-A Method of treating wiring substrate and wiring substrate manufactured by same MITSUBISHI GAS CHEMICAL CO 2014-10-29 CN claimed
CN-104120427-B The processing method of wiring substrate and the wiring substrate manufactured using this method 三菱瓦斯化学株式会社 2017-11-28 CN disclosed
CN-104120427-A Method of treating wiring substrate and wiring substrate manufactured by same MITSUBISHI GAS CHEMICAL CO 2014-10-29 CN disclosed
CN-103510089-A Liquid composition for etching and preparing method of multilayer printed wiring board using same MITSUBISHI GAS CHEMICAL CO 2014-01-15 CN disclosed
CN-103476198-A Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil MITSUBISHI GAS CHEMICAL CO 2013-12-25 CN disclosed
EP-1859782-A1 Composition for coloring and/or lightening human hair comprising tetrazoles Henkel Kommanditgesellschaft auf Aktien (DE) 2007-11-28 EP disclosed