SCHEMBL5318428

SCHEMBL5318428

CCCCCc1ccccc1P(=O)(c1ccccc1)c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LIPG Q9Y5X9 1/20 0.45
▸ MEN1 O00255 2/20 0.44
▸ KMT2A Q03164 2/20 0.44
▸ BID P55957 3/20 0.42
▸ MCL1 Q07820 3/20 0.42
▸ BCL2L1 Q07817 2/20 0.42
▸ BAK1 Q16611 2/20 0.42
▸ KAT8 Q9H7Z6 2/20 0.42
▸ PPARG P37231 1/20 0.42
▸ PPARA Q07869 1/20 0.42
▸ EP300 Q09472 1/20 0.42
▸ KAT2A Q92830 1/20 0.42
▸ KAT2B Q92831 1/20 0.42
▸ KAT5 Q92993 1/20 0.42
▸ SAE1 Q9UBE0 1/20 0.42
▸ NPSR1 Q6W5P4 1/20 0.41
▸ LMNA P02545 1/20 0.41
▸ NR1H2 P55055 1/20 0.41
▸ NR1H3 Q13133 1/20 0.41
▸ CYSLTR2 Q9NS75 3/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6443485 0.83 LIPG (0.49) LIPGBIDMCL1BCL2L1BAK1
SCHEMBL6441343 0.83 LIPG (0.49) LIPGBIDMCL1BCL2L1BAK1
SCHEMBL28312212 0.80 LIPG (0.45) LIPGBIDMCL1BCL2L1BAK1
Triphenylphosphine Oxide SCHEMBL27646660 0.80 LMNA (0.59) MEN1KMT2ANPSR1LMNA
SCHEMBL18261818 0.79 LIPG (0.51) LIPGBIDMCL1BCL2L1BAK1
SCHEMBL11519934 0.79 LIPG (0.51) LIPGBIDMCL1BCL2L1BAK1
SCHEMBL10787133 0.79 HIF1A (0.45) LIPGMEN1KMT2ABIDMCL1
SCHEMBL7658666 0.78 LIPG (0.54) LIPGBIDMCL1BCL2L1BAK1
SCHEMBL3463901 0.78 LIPG (0.54) LIPGBIDMCL1BCL2L1BAK1
SCHEMBL3463431 0.78 LIPG (0.54) LIPGBIDMCL1BCL2L1BAK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024135299-A1 LIQUID LEAKAGE REPAIR COMPOSITION AND LIQUID LEAKAGE REPAIR METHOD デクセリアルズ株式会社 2024-06-27 — — WO disclosed
WO-2024127938-A1 LIQUID LEAKAGE-REPAIRING METHOD デクセリアルズ株式会社 2024-06-20 — — WO disclosed
WO-2024106445-A1 COMPOSITION FOR REPAIRING LIQUID LEAKAGE AND METHOD FOR REPAIRING LIQUID LEAKAGE デクセリアルズ株式会社 2024-05-23 — — WO disclosed
US-11976769-B2 Oil leakage repairing material, oil leakage repairing method, and pipe DEXERIALS CORPORATION (JP) 2024-05-07 — — US disclosed
CN-117813355-A Pigment compositions, coloring compositions, coatings, inks, ink sets, prints and packaging materials 爱天思株式会社 2024-04-02 — — CN disclosed
US-11753560-B2 Ink set, recording method, and printed item TOYO INK SC HOLDINGS CO., LTD. (JP) 2023-09-12 — — US disclosed
WO-2023153337-A1 COMPOSITION FOR REPAIRING LIQUID LEAKAGE AND METHOD FOR REPAIRING LIQUID LEAKAGE デクセリアルズ株式会社 2023-08-17 — — WO disclosed
CN-112805350-B Liquid leakage repairing material, liquid leakage repairing method and piping 迪睿合株式会社 2023-08-08 — — CN disclosed
CN-113166573-B Active energy ray-curable inkjet ink, inkjet recorded matter, and method for producing inkjet recorded matter 东洋油墨SC控股株式会社 2023-02-28 — — CN disclosed
WO-2023013332-A1 PIGMENT COMPOSITION, COLORANT COMPOSITION, PAINT, INK, INK SET, PRINTED ARTICLE, AND PACKAGING MATERIAL 東洋インキSCホールディングス株式会社 2023-02-09 — — WO disclosed
CN-108473808-B High molecular weight polystyrene in inks and coatings 太阳化学公司 2021-06-08 — — CN disclosed
WO-2020200905-A1 A METHOD OF PRINTING AGFA NV (BE) 2020-10-08 — — WO disclosed
EP-3715140-A1 A METHOD OF PRINTING AGFA NV (BE) 2020-09-30 — — EP disclosed
EP-3644329-A1 OIL LEAKAGE REPAIR MATERIAL, METHOD FOR REPAIRING OIL LEAKAGE, AND PIPING Dexerials Corporation (JP) 2020-04-29 — — EP disclosed
US-20200124224-A1 OIL LEAKAGE REPAIRING MATERIAL, OIL LEAKAGE REPAIRING METHOD, AND PIPE DEXERIALS CORPORATION (JP) 2020-04-23 — — US disclosed
WO-2020066403-A1 REPAIRING MATERIAL FOR LIQUID LEAKAGE, REPARING METHOD FOR LIQUID LEAKAGE, AND PIPELINE デクセリアルズ株式会社 2020-04-02 — — WO disclosed
US-9441120-B2 Lithographic offset inks with water and filler content SUN CHEMICAL CORPORATION (US) 2016-09-13 — — US disclosed
US-20150184004-A1 LITHOGRAPHIC OFFSET INKS WITH WATER AND FILLER CONTENT SUN CHEMICAL CORPORATION (US) 2015-07-02 — — US disclosed
EP-1375569-B1 Radiation-curable mixtures comprising highly-branched polyesters having acrylate terminal groups DAINIPPON INK & CHEMICALS (JP) 2007-10-10 — — EP disclosed
EP-1375569-A1 Radiation-curable mixtures comprising highly-branched polyesters having acrylate terminal groups DAINIPPON INK AND CHEMICALS, INC. (JP) 2004-01-02 — — EP disclosed
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