SCHEMBL5320877

SCHEMBL5320877

[CH2]CCC[CH]C(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11518849 0.92
SCHEMBL7132092 0.78 ALDH1A1 (0.37)
SCHEMBL2800014 0.76
SCHEMBL125167 0.76
SCHEMBL5197098 0.76
SCHEMBL7135912 0.74
SCHEMBL130284 0.74
SCHEMBL20705080 0.73
SCHEMBL2260913 0.73
SCHEMBL8668253 0.72 TSHR (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1625183-B1 CURABLE COMPOSITIONS AND CURED FILM THEREOF JSR CORP (JP) 2007-11-21 EP disclosed
US-20060247353-A1 Curable compositions and cured film thereof JSR CORPORATION (JP) 2006-11-02 US disclosed
US-7122253-B2 Curable resin composition, cured film, and composite product DSM N.V. (NL) 2006-10-17 US disclosed
EP-1625183-A1 CURABLE COMPOSITIONS AND CURED FILM THEREOF DSM IP Assets B.V. (NL) 2006-02-15 EP disclosed
US-20040254282-A1 Light curable composition, and cured product and laminate therefrom JSR CORPORATION (JP) 2004-12-16 US disclosed
WO-2004104114-A1 CURABLE COMPOSITIONS AND CURED FILM THEREOF DSM IP ASSETS B.V. (NL) 2004-12-02 WO disclosed
EP-1447427-A1 LIGHT CURABLE COMPOSITION AND CURED PRODUCT AND LAMINATE THEREFROM JSR Corporation (JP) 2004-08-18 EP disclosed
US-20040096663-A1 Curable resin composition ,cured film, and composite product JSR CORPORATION (JP) 2004-05-20 US disclosed
US-6528604-B1 For coatings exhibiting excellent scratch resistance, weather resistance, adhesiveness and curability; polymerizable unsaturated group bonded via a silyloxy group DSM N.V. (NL) 2003-03-04 US disclosed
EP-1276810-A1 CURABLE RESIN COMPOSITION, CURED FILM, AND COMPOSITE PRODUCT DSM N.V. (NL) 2003-01-22 EP disclosed
WO-2001081466-A1 CURABLE RESIN COMPOSITION, CURED FILM, AND COMPOSITE PRODUCT DSM N.V. (NL) 2001-11-01 WO disclosed
US-6160067-A Reactive silica particles, process for manufacturing the same, use of the same DSM N.V. (NL) 2000-12-12 US disclosed
US-6093513-A OVERCOATING LAYER IS FORMED BY APPLYING AN UNSATURATED ORGANIC COMPOUND CHEMICALLY BONDED WITH SILICA PARTICLES AND A PHOTO POLYMERIZATION INITIATOR AND BY CURING THE ADDITION POLYMER NEC CORPORATION (JP) 2000-07-25 US disclosed
EP-0877777-B1 REACTIVE SILICA PARTICLES, PROCESS FOR MANUFACTURING THE SAME, USE OF THE SAME DSM NV (NL) 2000-01-05 EP disclosed
EP-0952492-A2 Photoreceptor for electrophotography and method of manufacturing the same NEC CORPORATION (JP) 1999-10-27 EP disclosed
EP-0877777-A1 REACTIVE SILICA PARTICLES, PROCESS FOR MANUFACTURING THE SAME, USE OF THE SAME DSM N.V. (NL) 1998-11-18 EP disclosed
WO-1997012942-A1 REACTIVE SILICA PARTICLES, PROCESS FOR MANUFACTURING THE SAME, USE OF THE SAME DSM N.V. (NL) 1997-04-10 WO disclosed
WO-1989002903-A1 PRODUCTION OF PHOTODEGRADABLE POLYESTER PLASTICS ECOPLASTICS LIMITED (CA) 1989-04-06 WO disclosed