SCHEMBL5331269

SCHEMBL5331269

O=C(O)CC(F)(F)F.[LiH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL185832 0.97
Hydrochloric Acid SCHEMBL1372205 0.93
SCHEMBL9746820 0.93
SCHEMBL3172604 0.93
SCHEMBL1533989 0.93
Methyl Alcohol SCHEMBL9196640 0.90 HMGCR (0.48)
Acetic Acid SCHEMBL288009 0.88 HMGCR (0.46)
Methylene Chloride SCHEMBL18039031 0.88 ACLY (0.42)
SCHEMBL4101909 0.88 ACLY (0.42)
Acetic Acid SCHEMBL29833661 0.85 HMGCR (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2007120714-A1 THERMALLY DEVELOPABLE MATERIALS WITH BURIED CONDUCTIVE BACKSIDE COATINGS EASTMAN KODAK COMPANY (US) 2007-10-25 WO disclosed
US-7258968-B1 Thermally developable materials with buried conductive backside coatings CARESTREAM HEALTH, INC. (US) 2007-08-21 US disclosed