⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1608023 | 0.86 | — | — | |
| SCHEMBL22661023 | 0.83 | — | — | |
| SCHEMBL19809293 | 0.82 | — | — | |
| SCHEMBL27777833 | 0.81 | THRB (0.35) | — | |
| SCHEMBL1609056 | 0.79 | — | — | |
| SCHEMBL19809200 | 0.78 | LMNA (0.31) | — | |
| SCHEMBL19809166 | 0.78 | — | — | |
| SCHEMBL27591304 | 0.77 | — | — | |
| SCHEMBL94015 | 0.76 | — | — | |
| SCHEMBL22654309 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112834088-B | Bionic MXene aerogel-based sensing material and preparation method and application thereof | 南开大学 | 2022-06-28 | — | — | CN | disclosed |
| CN-112834088-A | Bionic MXene aerogel-based sensing material and preparation method and application thereof | 南开大学 | 2021-05-25 | — | — | CN | disclosed |
| US-10696845-B2 | Energy-sensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-06-30 | — | — | US | disclosed |
| EP-3275940-B1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2019-12-18 | — | — | EP | disclosed |
| US-20190225804-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-07-25 | — | — | US | disclosed |
| EP-3275940-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| US-7238462-B2 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |