SCHEMBL5339026

SCHEMBL5339026

C=C(CC)c1ccc(S(=O)(=O)O)cc1.C=CC(=O)OCCO

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 5/20 0.47
▸ HPGD P15428 1/20 0.38
▸ THRB P10828 3/20 0.36
▸ TDP1 Q9NUW8 1/20 0.36
▸ ALDH1A1 P00352 3/20 0.34
▸ TP53 P04637 2/20 0.34
▸ HIF1A Q16665 2/20 0.34
▸ CYP3A4 P08684 1/20 0.34
▸ HSD17B10 Q99714 1/20 0.34
▸ CA1 P00915 2/20 0.33
▸ CA2 P00918 2/20 0.33
▸ S1PR3 Q99500 1/20 0.33
▸ F13A1 P00488 1/20 0.31
▸ TGM2 P21980 1/20 0.31
▸ TGM1 P22735 1/20 0.31
▸ CYP2C9 P11712 1/20 0.31
▸ GAA P10253 1/20 0.31
▸ KMT2A Q03164 1/20 0.31
▸ RXRA P19793 1/20 0.30
▸ RXRB P28702 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2374547 0.79 LMNA (0.45) TSHRTDP1ALDH1A1CA2KMT2A
SCHEMBL28231312 0.75 TSHR (0.44) TSHRHPGDTHRBTDP1ALDH1A1
Sulfuric Acid SCHEMBL1683520 0.72 TSHR (0.83) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL14545769 0.72 CA1 (0.49) TSHRTDP1ALDH1A1CA1CA2
SCHEMBL6930320 0.71 TSHR (0.56) TSHRHPGDTHRBTDP1ALDH1A1
Alcohol SCHEMBL28276836 0.71 TSHR (0.86) TSHRHPGDTHRBALDH1A1TP53
SCHEMBL29596121 0.71 — —
SCHEMBL27809280 0.70 TSHR (0.66) TSHRHPGDTHRBTDP1ALDH1A1
SCHEMBL1403432 0.70 CYP1A2 (0.43) TSHRHPGDTHRBTDP1ALDH1A1
SCHEMBL9146547 0.70 CYP1A2 (0.41) TSHRHPGDTHRBTDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7238462-B2 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-03 — — US disclosed
US-20060141693-A1 Semiconductor multilayer interconnection forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2006-06-29 — — US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 — — US disclosed
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