SCHEMBL534035

SCHEMBL534035

CC[Si](Cc1ccccc1)(OC)OC

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.44
LTA4H P09960 1/20 0.39
TSHR P16473 5/20 0.37
CALM1 P0DP23 1/20 0.36
ALDH1A1 P00352 4/20 0.34
IDO1 P14902 2/20 0.34
MAPK1 P28482 1/20 0.34
KDM4E B2RXH2 2/20 0.33
TDP1 Q9NUW8 1/20 0.33
LOXL2 Q9Y4K0 1/20 0.33
AGXT P21549 1/20 0.33
TRPA1 O75762 1/20 0.33
CYP3A4 P08684 1/20 0.33
MAPT P10636 1/20 0.33
MAOB P27338 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2804442 0.91 TP53 (0.42) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL19809224 0.88 TP53 (0.38) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL19809283 0.85 TP53 (0.39) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL15302477 0.85 TP53 (0.39) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL19809201 0.85 TP53 (0.35) TP53LTA4HTSHRALDH1A1MAPK1
SCHEMBL5702388 0.83 LOXL2 (0.41) TP53LTA4HTSHRIDO1LOXL2
SCHEMBL3338410 0.83 TSHR (0.37) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL12749821 0.83 TSHR (0.41) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL15302747 0.82 SMN1; SMN2 (0.37) TP53LTA4HMAPK1MEN1KMT2A
SCHEMBL19809327 0.82 LMNA (0.38) TP53LTA4HTSHRALDH1A1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
CN-117396811-A Composition for forming underlayer film of silicon-containing resist 日产化学株式会社 2024-01-12 CN disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
CN-102076723-A Curable composition and cured product thereof SHOWA DENKO KK 2011-05-25 CN disclosed
US-20110098411-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2011-04-28 US disclosed
CN-102037035-A Curable composition containing a reactive (meth)acrylate polymer and a cured product thereof SHOWA DENKO KK 2011-04-27 CN disclosed
US-20110077334-A1 CURABLE COMPOSITION CONTAINING REACTIVE (METH) ACRYLATE POLYMER AND CURED PRODUCTS THEREOF SHOWA DENKO K.K. (JP) 2011-03-31 US disclosed
EP-2298822-A1 HARDENING COMPOSITION AND RESULTANT HARDENED MATERIAL Showa Denko K.K. (JP) 2011-03-23 EP disclosed
EP-2295481-A1 CURABLE COMPOSITION CONTAINING A REACTIVE (METH)ACRYLATE POLYMER AND A CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2011-03-16 EP disclosed
CN-101646718-A The formation method of curable resin composition, protective membrane and protective membrane JSR CORP JP 2010-02-10 CN disclosed
CN-101226329-A Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof JSR CORP (JP) 2008-07-23 CN disclosed
CN-1027643-C Catalyst component and catalyst for olefin polymerization HIMONT INC (US) 1995-02-15 CN disclosed
CN-1053241-A The catalyst component of olefinic polymerization and catalyzer HIMONT INC (US) 1991-07-24 CN disclosed