SCHEMBL5345479

SCHEMBL5345479

CCCCO[SiH](OCCC)OCCC

nearest known ligand 0.41

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ADRB2 P07550 1/20 0.41
ADRB1 P08588 1/20 0.41
ADRB3 P13945 1/20 0.41
TSHR P16473 5/20 0.36
CYP3A4 P08684 2/20 0.36
ALDH1A1 P00352 1/20 0.35
SMN1; SMN2 Q16637 2/20 0.34
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
LMNA P02545 1/20 0.33
ATM Q13315 1/20 0.32
THRB P10828 1/20 0.32
HPGD P15428 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15414776 1.00 ADRB2 (0.41) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL310148 0.94 ADRB2 (0.45) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL3871723 0.92 ADRB2 (0.36) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL1609569 0.92 THRB (0.37) TSHRALDH1A1CA1CA2THRB
SCHEMBL5340708 0.92 THRB (0.37) TSHRALDH1A1CA1CA2THRB
Fluoride SCHEMBL27823338 0.91 ADRB2 (0.43) ADRB2ADRB1ADRB3TSHRCYP3A4
Hydrochloric Acid SCHEMBL9709345 0.91 ADRB2 (0.43) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL16497481 0.88 ADRB2 (0.41) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL22661054 0.88 ADRB2 (0.41) ADRB2ADRB1ADRB3TSHRCYP3A4
SCHEMBL27814 0.87 CA1 (0.30) CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2872461-A2 POWDER MIXTURE AND PROCESS TO MAKE DRY MORTAR Akzo Nobel Chemicals International B.V. (NL) 2015-05-20 EP disclosed
WO-2014009299-A2 POWDER MIXTURE AND PROCESS TO MAKE DRY MORTAR AKZO NOBEL CHEMICALS INTERNATIONAL B.V. (NL) 2014-01-16 WO disclosed
US-7238462-B2 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-03 US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 US disclosed