SCHEMBL5345898

SCHEMBL5345898

CC1(C)OC(=O)CC1O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16475536 0.77 ALDH1A1 (0.36)
SCHEMBL7746228 0.76
SCHEMBL20671031 0.76 ALDH1A1 (0.39)
SCHEMBL30818409 0.74 TYR (0.35)
SCHEMBL12227793 0.74 LMNA (0.38)
SCHEMBL13327624 0.73
SCHEMBL16904971 0.73
SCHEMBL6059815 0.73
SCHEMBL10688299 0.73 ALDH1A1 (0.40)
SCHEMBL10686103 0.73 ALDH1A1 (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1693705-B1 Positive resist composition and pattern forming method using the resist composition FUJIFILM CORP (JP) 2014-01-22 EP disclosed
US-7183423-B1 Process for the preparation of organic compounds with imide catalysts DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-02-27 US disclosed
US-7163781-B2 Process for producing a semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2007-01-16 US disclosed
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
US-6692889-B1 COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-02-17 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1055654-A1 PROCESS FOR THE PREPARATION OF ORGANIC COMPOUNDS WITH IMIDE CATALYSTS Daicel Chemical Industries, Ltd. (JP) 2000-11-29 EP disclosed
US-4968817-A COBALT OR NICKEL CATALYST NATIONAL DISTILLERS AND CHEMICAL CORPORATION (US) 1990-11-06 US disclosed