SCHEMBL5356468

SCHEMBL5356468

C/C=C/C(=O)OC(CCCCC)N=C=O

nearest known ligand 0.33

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.33
SMPD1 P17405 3/20 0.32
ATM Q13315 1/20 0.32
HCAR2 Q8TDS4 2/20 0.31
ZDHHC7 Q9NXF8 1/20 0.31
GPR84 Q9NQS5 3/20 0.31
FFAR1 O14842 1/20 0.31
CA1 P00915 1/20 0.31
FAAH O00519 1/20 0.31
GRIK1 P39086 1/20 0.30
SLC1A2 P43004 1/20 0.30
SLC1A1 P43005 1/20 0.30
GRIK2 Q13002 1/20 0.30
TP53 P04637 1/20 0.30
LAP3 P28838 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5356473 1.00 MAPT (0.33) MAPTSMPD1ATMHCAR2ZDHHC7
SCHEMBL5370754 0.95 ATM (0.33) ATMCA1
SCHEMBL5370761 0.95 ATM (0.33) ATMCA1
SCHEMBL3695168 0.89
SCHEMBL3695161 0.89
SCHEMBL5354708 0.84 TSHR (0.41) MAPTZDHHC7GPR84FFAR1CA1
SCHEMBL5354170 0.83
SCHEMBL5354164 0.83
SCHEMBL5358881 0.82 TSHR (0.40) MAPTZDHHC7GPR84FFAR1FAAH
SCHEMBL17377701 0.82 TSHR (0.40) MAPTZDHHC7GPR84FFAR1FAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7282323-B2 Highly heat-resistant, negative-type photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-10-16 US disclosed
US-20050244739-A1 Highly heat-resistant, negative-type photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2005-11-03 US disclosed
EP-1536286-A1 HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2005-06-01 EP disclosed
US-5847071-A Photosensitive resin composition HITACHI, CHEMICAL CO., LTD. (JP) 1998-12-08 US disclosed
US-5668248-A POLYAMIC ACID ESTERS HITACHI CHEMICAL CO., LTD. (JP) 1997-09-16 US disclosed
US-5472823-A Polyamic acids HITACHI CHEMICAL CO., LTD. (JP) 1995-12-05 US disclosed
EP-0373952-B1 Photosensitive resin composition and photosensitive element using the same HITACHI CHEMICAL CO LTD (JP) 1995-02-08 EP disclosed
US-5262277-A Light sensitive elements for electrical thick films with heat resistance HITACHI CHEMICAL COMPANY, INC. (JP) 1993-11-16 US disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed