SCHEMBL535697

SCHEMBL535697

Cc1c[nH]c(-c2cccc3ccccc23)n1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.48
CYP1A2 P05177 1/20 0.48
CYP3A4 P08684 1/20 0.48
CYP2C19 P33261 1/20 0.48
DHFR P00374 1/20 0.41
ALOX15 P16050 2/20 0.41
ALDH1A1 P00352 3/20 0.41
CYP2A6 P11509 1/20 0.41
PI4KA P42356 1/20 0.40
PI4K2B Q8TCG2 1/20 0.40
PI4K2A Q9BTU6 1/20 0.40
PI4KB Q9UBF8 1/20 0.40
NISCH Q9Y2I1 1/20 0.40
ENPP3 O14638 1/20 0.40
ENPP1 P22413 1/20 0.40
HPGD P15428 2/20 0.39
AR P10275 1/20 0.38
ALPL P05186 1/20 0.38
GAA P10253 1/20 0.38
MCL1 Q07820 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29724732 1.00 KDM4E (0.48) KDM4ECYP1A2CYP3A4CYP2C19DHFR
Hydrochloric Acid SCHEMBL4345831 0.81 HPGD (0.38) KDM4ECYP1A2ALDH1A1NISCHHPGD
SCHEMBL31429620 0.80 F2 (0.43) KDM4ECYP1A2CYP2A6ARGAA
SCHEMBL27824969 0.80 PDGFRB (0.45) KDM4ECYP1A2CYP3A4CYP2C19ALOX15
SCHEMBL24360032 0.79 DCUN1D1 (0.50) KDM4EALDH1A1NISCHHPGDAR
SCHEMBL5554694 0.79 KDM4E (0.40) KDM4ECYP1A2CYP3A4CYP2C19DHFR
SCHEMBL27741657 0.78 ENPP3 (0.47) KDM4ECYP1A2CYP3A4CYP2C19DHFR
SCHEMBL2432224 0.76 KDM4E (0.57) KDM4EALDH1A1HPGDGAAHSD17B10
SCHEMBL8784700 0.76 GAA (0.47) ALDH1A1ARGAA
SCHEMBL3322110 0.76 MGAM (0.47) KDM4ECYP1A2CYP3A4CYP2C19ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105087182-A Circuit substrate cured with solder, a manufacturing method of circuit substrate equipped with electronic part, and cleaning agent composition for fluxing agent KAO CORP 2015-11-25 CN claimed
EP-1753728-B1 PHENYLNAPHTHYLIMIDAZOLES FOR USE ON COPPER SURFACES DURING SOLDERING SHIKOKU CHEM (JP) 2012-12-19 EP claimed
US-20240118612-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2024-04-11 US disclosed
CN-114644860-A Pigment dispersion composition for black matrix, resist composition for black matrix, and black matrix 阪田油墨株式会社 2022-06-21 CN disclosed
CN-105087182-B Circuit board having solder solidified thereon, method for producing circuit board having electronic component mounted thereon, and cleaning agent composition for flux 花王株式会社 2020-08-14 CN disclosed
CN-105087182-A Circuit substrate cured with solder, a manufacturing method of circuit substrate equipped with electronic part, and cleaning agent composition for fluxing agent KAO CORP 2015-11-25 CN disclosed
EP-1952918-B1 METHOD FOR PRODUCING METAL PARTICLE DISPERSION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM TOYO INK MFG CO (JP) 2013-05-22 EP disclosed
US-8440110-B2 Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film TOYO INK MFG CO., LTD. (JP) 2013-05-14 US disclosed
CN-101287566-B Method for producing metal microparticle dispersion, conductive ink using metal microparticle dispersion produced by the method, and conductive coating film TOYO INK MFG CO 2012-05-23 CN disclosed
EP-1990377-B1 COLORED METALLIC PIGMENT, PROCESS FOR PRODUCING THE SAME, AND COATING COMPOSITION AND COSMETIC PREPARATION CONTAINING SAID COLORED METALLIC PIGMENT TOYO ALUMINIUM KK (JP) 2012-02-08 EP disclosed
CN-101384674-B Colored metallic pigment, process for producing the same, and coating composition and cosmetic preparation comprising said colored metallic pigment TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2011-12-28 CN disclosed
US-7998266-B2 Colored metallic pigment, process for producing the same, and coating composition and cosmetic preparation containing said colored metallic pigment TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2011-08-16 US disclosed
US-20110175040-A1 METHOD FOR PRODUCING METAL PARTICLE DISPRESION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM TOYO INK MFG CO., LTD. (JP) 2011-07-21 US disclosed
US-7981327-B2 Method for producing metal particle dispersion, conductive ink using metal particle dispersion produced by such method, and conductive coating film TOYO INK MFG. CO. LTD. (JP) 2011-07-19 US disclosed
US-20090258202-A1 Method for Producing Metal Particle Dispersion, Conductive Ink Using Metal Particle Dispersion Produced by Such Method, and Conductive Coating Film GVP GESELLSCHAFT ZUR VERMARKTUNG DER PORENBRENNERTECHNIK MBH (DE) 2009-10-15 US disclosed
CN-101384674-A Colored metallic pigment, process for producing the same, and coating composition and cosmetic preparation comprising said colored metallic pigment TOYO ALUMINIUM KK (JP) 2009-03-11 CN disclosed
US-20090017082-A1 COLORED METALLIC PIGMENT, PROCESS FOR PRODUCING THE SAME, AND COATING COMPOSITION AND COSMETIC PREPARATION CONTAINING SAID COLORED METALLIC PIGMENT TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2009-01-15 US disclosed
EP-1990377-A1 COLORED METALLIC PIGMENT, PROCESS FOR PRODUCING THE SAME, AND COATING COMPOSITION AND COSMETIC PREPARATION COMPRISING SAID COLORED METALLIC PIGMENT TOYO ALUMINIUM KABUSHIKI KAISHA (JP) 2008-11-12 EP disclosed
CN-101287566-A Method for producing metal microparticle dispersion, conductive ink using metal microparticle dispersion produced by the method, and conductive coating film TOYO INK MFG CO (JP) 2008-10-15 CN disclosed
EP-1952918-A1 METHOD FOR PRODUCING METAL PARTICLE DISPERSION, CONDUCTIVE INK USING METAL PARTICLE DISPERSION PRODUCED BY SUCH METHOD, AND CONDUCTIVE COATING FILM Toyo Ink Mfg. Co., Ltd (JP) 2008-08-06 EP disclosed