SCHEMBL5358088

SCHEMBL5358088

O=C(O)OC(C1CCC2OC2C1)C1CCC2OC2C1

nearest known ligand 0.39

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TFPI2 P48307 4/20 0.39
KDM4E B2RXH2 2/20 0.39
LMNA P02545 2/20 0.39
GMNN O75496 1/20 0.39
PMP22 Q01453 1/20 0.39
TP53 P04637 1/20 0.39
TSHR P16473 1/20 0.39
NFKB1 P19838 1/20 0.39
THPO P40225 1/20 0.39
PPM1B O75688 4/20 0.34
PTPN1 P18031 3/20 0.34
PPP1CC P36873 3/20 0.34
ALDH1A1 P00352 1/20 0.31
FPR1 P21462 1/20 0.31
HTT P42858 1/20 0.31
HSD17B10 Q99714 1/20 0.31
PPP5C P53041 2/20 0.30
PPP2CA P67775 1/20 0.30
NPY4R P50391 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31118575 0.80 PPM1B (0.32) TFPI2KDM4ELMNAGMNNPMP22
SCHEMBL1314493 0.79 LMNA (0.36) TFPI2KDM4ELMNAGMNNPMP22
SCHEMBL36591 0.77 PPM1B (0.36) TFPI2KDM4ELMNAGMNNPMP22
SCHEMBL15069507 0.74 TFPI2 (0.43) TFPI2KDM4ELMNAGMNNPMP22
SCHEMBL7760106 0.72 KDM4E (0.33) TFPI2KDM4ELMNAGMNNPMP22
SCHEMBL28400955 0.69 EPHX1 (0.43) KDM4ETP53ALDH1A1
SCHEMBL7930114 0.68 TFPI2 (0.41) TFPI2KDM4ELMNAGMNNPMP22
SCHEMBL4455985 0.68
SCHEMBL3781783 0.67 PPM1B (0.33) KDM4ELMNAPPM1BPTPN1PPP1CC
SCHEMBL25353670 0.67 TFPI2 (0.36) TFPI2KDM4ELMNAGMNNPMP22

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020035201-A1 No-flow reworkable epoxy underfills for flip-chip applications GEORGIA TECH RESEARCH CORPORATION 2002-03-21 US claimed
US-20020013420-A1 Thermally degradable epoxy underfills for flip-chip applications GEORGIA TECH RESEARCH CORP. 2002-01-31 US claimed
WO-2001088959-A2 NO-FLOW REWORKABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-11-22 WO claimed
WO-2001072898-A1 THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-10-04 WO claimed
US-7288161-B2 Reworkable adhesives containing thermally labile groups INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-10-30 US disclosed
US-20060014924-A1 Reworkable adhesives containing thermally labile groups INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2006-01-19 US disclosed
US-6570029-B2 Encapsulation of electronics GEORGIA TECH RESEARCH CORP. 2003-05-27 US disclosed
US-6498260-B2 POLYEPOXIDES; ELECTRONIC PACKAGES GEORGIA TECH RESEARCH CORP. 2002-12-24 US disclosed
US-20020035201-A1 No-flow reworkable epoxy underfills for flip-chip applications GEORGIA TECH RESEARCH CORPORATION 2002-03-21 US disclosed
US-20020013420-A1 Thermally degradable epoxy underfills for flip-chip applications GEORGIA TECH RESEARCH CORP. 2002-01-31 US disclosed
WO-2001072898-A1 THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-10-04 WO disclosed