SCHEMBL5360765

SCHEMBL5360765

CCOC(=O)C(O)CC(=O)[O-].CCOC(=O)C(O)CC(=O)[O-].C[Sn+2]C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.46
CA2 P00918 1/20 0.37
SLC22A16 Q86VW1 1/20 0.36
ALDH1A1 P00352 2/20 0.36
LMNA P02545 1/20 0.34
HSD17B10 Q99714 1/20 0.34
ALOX15 P16050 1/20 0.33
MGAM O43451 1/20 0.33
GAA P10253 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33
SOAT1 P35610 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2C9 P11712 1/20 0.33
HIF1A Q16665 1/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
NPC1 O15118 1/20 0.33
CYP2C19 P33261 1/20 0.33
RECQL P46063 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Potassium Ion SCHEMBL23607609 0.92 CA4 (0.50) CA4CA2SLC22A16ALDH1A1LMNA
SCHEMBL31078478 0.92 CA4 (0.50) CA4CA2SLC22A16ALDH1A1LMNA
SCHEMBL4283602 0.83 CA4 (0.38) CA4HSD17B10CYP2C9HIF1AMEN1
SCHEMBL5357701 0.82 ALDH1A1 (0.42) CA4ALDH1A1
SCHEMBL5372332 0.82 CA4 (0.48) CA4CA2SLC22A16CYP1A2MEN1
Malic Acid SCHEMBL6061381 0.76 CA4 (0.80) CA4CA2SLC22A16CYP1A2MEN1
SCHEMBL11147064 0.75 ALDH1A1 (0.42) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL4388130 0.74 MGAM (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL305091 0.74 SMN1; SMN2 (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL122314 0.74 MGAM (0.50) ALDH1A1LMNAHSD17B10ALOX15MGAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070298178-A1 Two Packages Type Thermosetting Resin Composition, Film Forming Method and Coated Article TANABE HISAKI 2007-12-27 US disclosed