SCHEMBL5364263

SCHEMBL5364263

O=CNCn1nnc2ccccc21.On1nnc2ccccc21

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.58
MAPK1 P28482 1/20 0.58
ATM Q13315 1/20 0.58
RPS6KA3 P51812 1/20 0.51
EGLN3 Q9H6Z9 1/20 0.47
SLC9A1 P19634 3/20 0.46
MAPT P10636 2/20 0.46
KDM4E B2RXH2 1/20 0.46
RAB9A P51151 3/20 0.46
MGAM O43451 2/20 0.46
AMY1A P0DUB6 2/20 0.46
GAA P10253 2/20 0.46
SI P14410 2/20 0.46
MGAM2 Q2M2H8 2/20 0.46
NPC1 O15118 2/20 0.46
CYP1A2 P05177 3/20 0.45
CYP2C9 P11712 3/20 0.45
CYP2C19 P33261 3/20 0.45
ALDH1A1 P00352 1/20 0.45
GRM2 Q14416 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29883008 0.91 RPS6KA3 (0.55) POLBRPS6KA3EGLN3SLC9A1MAPT
SCHEMBL2491283 0.91 RPS6KA3 (0.55) POLBRPS6KA3EGLN3SLC9A1MAPT
SCHEMBL3403852 0.77 SLC9A1 (0.63) POLBRPS6KA3EGLN3SLC9A1MAPT
SCHEMBL1012471 0.76 POLB (1.00) POLBMAPK1ATMEGLN3SLC9A1
SCHEMBL184 0.76 POLB (1.00) POLBMAPK1ATMEGLN3SLC9A1
SCHEMBL3672275 0.76 POLB (1.00) POLBMAPK1ATMEGLN3SLC9A1
SCHEMBL6005162 0.76 RPS6KA3 (0.55) POLBRPS6KA3EGLN3SLC9A1MAPT
Phosphine SCHEMBL23702726 0.75 POLB (0.95) POLBMAPK1ATMEGLN3SLC9A1
SCHEMBL875075 0.75 POLB (0.95) POLBMAPK1ATMEGLN3SLC9A1
SCHEMBL875034 0.75 POLB (0.95) POLBMAPK1ATMEGLN3SLC9A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7300874-B2 Chemical mechanical polishing compositions and methods relating thereto ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2007-11-27 US disclosed
US-20050159003-A1 Chemical mechanical polishing compositions and methods relating thereto WEINSTEIN BARRY (US) 2005-07-21 US disclosed
US-6902590-B2 Chemical mechanical polishing compositions and methods relating thereto ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC (US) 2005-06-07 US disclosed
US-20040065020-A1 Chemical mechanical polishing compositions and methods relating thereto WEINSTEIN BARRY (US) 2004-04-08 US disclosed
EP-1399517-A2 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS RELATING THERETO Rodel Holdings, Inc. (US) 2004-03-24 EP disclosed
US-6632259-B2 Mixtures of copolymers, abrasives, oxidizers, corrosion inhibitors and complexing agents, used for selectively etching copper layers from semiconductor substrates RODEL HOLDINGS, INC. 2003-10-14 US disclosed
US-20030032371-A1 Chemical mechanical polishing compositions and methods relating thereto ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2003-02-13 US disclosed
US-20030013386-A1 Chemical mechanical polishing compositions and methods relating thereto RODEL HOLDINGS, INC. 2003-01-16 US disclosed
WO-2002094957-A2 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS RELATING THERETO RODEL HOLDINGS, INC. (US) 2002-11-28 WO disclosed
US-20020132560-A1 Polishing method for selective chemical mechanical polishing of semiconductor substrates RODEL HOLDINGS, INC. 2002-09-19 US disclosed
US-20020062600-A1 Polishing composition RODEL HOLDINGS, INC. 2002-05-30 US disclosed