SCHEMBL5367784

SCHEMBL5367784

CCC(c1nc(N)nc(N)n1)n1ccnc1

nearest known ligand 0.49

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
▸ CYP17A1 P05093 18/20 0.49
▸ CYP11B1 P15538 2/20 0.43
▸ CYP11B2 P19099 2/20 0.43
▸ CYP3A4 P08684 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1252537 0.90 CYP11B1 (0.42) CYP17A1CYP11B1CYP11B2CYP3A4
SCHEMBL973378 0.84 CYP17A1 (0.49) CYP17A1CYP11B1CYP11B2
SCHEMBL5138691 0.78 CYP17A1 (0.45) CYP17A1CYP11B1CYP11B2
SCHEMBL5433761 0.71 CYP17A1 (0.40) CYP17A1CYP11B1CYP11B2CYP3A4
SCHEMBL18789339 0.71 TSHR (0.41) CYP17A1
SCHEMBL9663469 0.71 CYP17A1 (0.59) CYP17A1CYP11B1CYP11B2CYP3A4
SCHEMBL5297627 0.70 CYP17A1 (0.82) CYP17A1CYP11B1CYP11B2CYP3A4
SCHEMBL28563811 0.70 TSHR (0.44) —
SCHEMBL28134216 0.70 CYP17A1 (0.52) CYP17A1CYP11B1CYP11B2CYP3A4
SCHEMBL27793815 0.69 CYP17A1 (0.50) CYP17A1CYP11B1CYP11B2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7282257-B2 Resin composition and adhesive film for multi-layered printing wiring board AJINOMOTO CO., INC. (JP) 2007-10-16 — — US disclosed
EP-1403291-B1 PROCESS FOR PRODUCING POLYMER HAVING CROSSLINKABLE SILYL GROUP AND CURABLE COMPOSITION KANEKA CORP (JP) 2007-08-29 — — EP disclosed
US-7211625-B2 Thermoplastic resin composition and elastomer composition KANEKA CORPORATION (JP) 2007-05-01 — — US disclosed
US-7081503-B2 Process producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition KANEKA CORPORATION (JP) 2006-07-25 — — US disclosed
US-7009004-B2 Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition KANEKA CORPORATION (JP) 2006-03-07 — — US disclosed
US-6992138-B2 Polyurethane polymer KANEKA CORPORATION (JP) 2006-01-31 — — US disclosed
US-20060004171-A1 Process for producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition TSUJI RYOTARO 2006-01-05 — — US disclosed
US-6914110-B2 Process for producing polymer having crosslinkable silyl group and curable composition KANEKA CORPORATION (JP) 2005-07-05 — — US disclosed
US-20050019554-A1 Resin composition and adhesive film for multi-layered printed wiring board AJINOMOTO CO., INC. (JP) 2005-01-27 — — US disclosed
US-20040220364-A1 Process for producing polymer having crosslinkable silyl group and curable composition KANEKA CORPORATION (JP) 2004-11-04 — — US disclosed
US-20040171765-A1 Polyurethane polymer KANEKA CORPORATION (JP) 2004-09-02 — — US disclosed
US-20040106732-A1 Thermoplastic resin composition and elastomer composition KANEKA CORPORATION (JP) 2004-06-03 — — US disclosed
US-20040097678-A1 Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition KANEKA CORPORATION (JP) 2004-05-20 — — US disclosed
EP-1403291-A1 PROCESS FOR PRODUCING POLYMER HAVING CROSSLINKABLE SILYL GROUP AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-03-31 — — EP disclosed
EP-1375531-A1 PROCESS FOR PRODUCING VINYL POLYMER HAVING ALKENYL GROUP AT END, VINYL POLYMER, AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-01-02 — — EP disclosed
US-6370350-B2 Method for developing electrostatic latent image and developing roller and developing device therefor RICOH COMPANY LIMITED (JP) 2002-04-09 — — US disclosed
US-20010014233-A1 Method for developing electrostatic latent image and developing roller and developing device therefor RICOH COMPANY LIMITED (JP) 2001-08-16 — — US disclosed
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