Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP11B1 | P15538 | 2/20 | 0.42 |
| ▸ | CYP11B2 | P19099 | 2/20 | 0.42 |
| ▸ | CYP17A1 | P05093 | 17/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5367784 | 0.90 | CYP17A1 (0.49) | CYP11B1CYP11B2CYP17A1CYP3A4 | |
| SCHEMBL5433761 | 0.82 | CYP17A1 (0.40) | CYP11B1CYP11B2CYP17A1CYP3A4 | |
| SCHEMBL973378 | 0.76 | CYP17A1 (0.49) | CYP11B1CYP11B2CYP17A1 | |
| SCHEMBL5138691 | 0.70 | CYP17A1 (0.45) | CYP11B1CYP11B2CYP17A1 | |
| SCHEMBL6132132 | 0.65 | TSHR (0.32) | — | |
| SCHEMBL18789339 | 0.64 | TSHR (0.41) | CYP17A1 | |
| SCHEMBL6901700 | 0.64 | FPR2 (0.32) | — | |
| SCHEMBL9663469 | 0.64 | CYP17A1 (0.59) | CYP11B1CYP11B2CYP17A1CYP3A4 | |
| SCHEMBL18063558 | 0.63 | CYP17A1 (0.42) | CYP11B1CYP11B2CYP17A1CYP3A4 | |
| SCHEMBL5297627 | 0.63 | CYP17A1 (0.82) | CYP11B1CYP11B2CYP17A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7883783-B2 | smooth surfaces on both sides with corrosion resistance; resin layer composed of an epoxy resin and a curing agent, a solvent soluble aromatic polyamide resin polymer | MITSUI MINING & SMELTING CO., LTD. (JP) | 2011-02-08 | — | — | US | disclosed |
| US-20070207337-A1 | Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board | MITSUI MINING & SMELTING CO., LTD. (JP) | 2007-09-06 | — | — | US | disclosed |
| US-7208062-B2 | Method of producing multilayer printed wiring board | AJINOMOTO CO., INC. (JP) | 2007-04-24 | — | — | US | disclosed |
| US-7166180-B2 | Method of vacuum-laminating adhesive film | AJINOMOTO CO., INC. (JP) | 2007-01-23 | — | — | US | disclosed |
| EP-0851726-B1 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | AJINOMOTO KK (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-7037586-B2 | Film for circuit board | AJINOMOTO CO., INC. (JP) | 2006-05-02 | — | — | US | disclosed |
| US-20050178501-A1 | Process for producing a multi-layer printer wiring board | AJINOMOTO CO., INC. (JP) | 2005-08-18 | — | — | US | disclosed |
| US-6881293-B2 | Process for producing a multi-layer printer wiring board | AJINOMOTO CO., INC. (JP) | 2005-04-19 | — | — | US | disclosed |
| US-20050005437-A1 | Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board | AJINOMOTO CO., INC. (JP) | 2005-01-13 | — | — | US | disclosed |
| US-20040261941-A1 | Method of vacuum-laminating adhesive film | AJINOMOTO CO., INC. (JP) | 2004-12-30 | — | — | US | disclosed |
| EP-1092739-B1 | Epoxy resin composition and uses thereof | AJINOMOTO KK (JP) | 2002-12-11 | — | — | EP | disclosed |
| US-20020076539-A1 | Process for producing a multi-layer printer wiring board | NAKAMURA SHIGEO (JP) | 2002-06-20 | — | — | US | disclosed |
| US-6403221-B1 | EPOXY RESIN CONTAINING PHOSPHORUS, PHENOLIC CURING AGENT, BISPHENOL S PHENOLIC RESIN AND ACCELERATOR; HEAT RESISTANCE; PEELING STRENGTH | AJINOMOTO CO., INC. (JP) | 2002-06-11 | — | — | US | disclosed |
| US-6376053-B1 | BLEND OF EPOXY RESIN AND CURING AGENTS | AJINOMOTO CO., INC. (JP) | 2002-04-23 | — | — | US | disclosed |
| US-6346164-B1 | Method of vacuum-laminating adhesive film | AJINOMOTO CO., INC. (JP) | 2002-02-12 | — | — | US | disclosed |
| EP-1095766-A2 | Apparatus and method for vacuum lamination of adhesive film | Ajinomoto Co., Inc. (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1096842-A2 | Method of manufacturing multilayered printed wiring board using adhesive film | Ajinomoto Co., Inc. (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1092739-A1 | Epoxy resin composition and uses thereof | Ajinomoto Co., Inc. (JP) | 2001-04-18 | — | — | EP | disclosed |
| EP-1009206-A2 | Method of vacuum-laminating adhesive film | Ajinomoto Co., Inc. (JP) | 2000-06-14 | — | — | EP | disclosed |
| EP-0851726-A2 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | Ajinomoto Co., Inc. (JP) | 1998-07-01 | — | — | EP | disclosed |