SCHEMBL973378

SCHEMBL973378

CCCCCCCCCCCCC(c1nc(N)nc(N)n1)n1ccnc1

nearest known ligand 0.51

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
▸ CYP17A1 P05093 14/20 0.49
▸ TBXAS1 P24557 1/20 0.40
▸ CYP11B1 P15538 2/20 0.34
▸ CYP11B2 P19099 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5367784 0.84 CYP17A1 (0.49) CYP17A1CYP11B1CYP11B2
SCHEMBL18789340 0.81 CYP17A1 (0.39) CYP17A1TBXAS1
SCHEMBL9664909 0.76 CYP17A1 (0.57) CYP17A1CYP11B1CYP11B2
SCHEMBL1252537 0.76 CYP11B1 (0.42) CYP17A1CYP11B1CYP11B2
SCHEMBL28569780 0.76 TSHR (0.39) —
SCHEMBL28650976 0.74 TBXAS1 (0.47) CYP17A1TBXAS1
SCHEMBL28227574 0.74 TBXAS1 (0.47) CYP17A1TBXAS1
SCHEMBL9722522 0.74 TBXAS1 (0.50) CYP17A1TBXAS1
SCHEMBL3851254 0.74 TBXAS1 (0.50) CYP17A1TBXAS1
SCHEMBL3421199 0.74 TBXAS1 (0.50) CYP17A1TBXAS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101959979-B Nonaqueous inkjet ink composition DAINIPPON TORYO KK 2014-05-07 — — CN disclosed
US-8440745-B2 Nonaqueous inkjet ink composition DAI NIPPON TORYO CO., LTD. (JP) 2013-05-14 — — US disclosed
EP-2284226-A1 NONAQUEOUS INKJET INK COMPOSITION Dai Nippon Toryo Co., Ltd. (JP) 2011-02-16 — — EP disclosed
US-20110009537-A1 Nonaqueous Inkjet Ink Composition DAI NIPPON TORYO CO., LTD. (JP) 2011-01-13 — — US disclosed
EP-1403291-B1 PROCESS FOR PRODUCING POLYMER HAVING CROSSLINKABLE SILYL GROUP AND CURABLE COMPOSITION KANEKA CORP (JP) 2007-08-29 — — EP disclosed
US-7208062-B2 Method of producing multilayer printed wiring board AJINOMOTO CO., INC. (JP) 2007-04-24 — — US disclosed
EP-0851726-B1 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same AJINOMOTO KK (JP) 2006-05-03 — — EP disclosed
US-7037586-B2 Film for circuit board AJINOMOTO CO., INC. (JP) 2006-05-02 — — US disclosed
US-20050178501-A1 Process for producing a multi-layer printer wiring board AJINOMOTO CO., INC. (JP) 2005-08-18 — — US disclosed
US-6881293-B2 Process for producing a multi-layer printer wiring board AJINOMOTO CO., INC. (JP) 2005-04-19 — — US disclosed
US-20050005437-A1 Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board AJINOMOTO CO., INC. (JP) 2005-01-13 — — US disclosed
EP-1453364-A1 FILM FOR CIRCUIT BOARD Ajinomoto Co., Inc. (JP) 2004-09-01 — — EP disclosed
US-20040142155-A1 Film for circuit board AJINOMOTO CO., INC (JP) 2004-07-22 — — US disclosed
US-20040099367-A1 Adhesive film and method for manufacturing multilayer printed wiring board comprising the same AJINOMOTO CO., INC. (JP) 2004-05-27 — — US disclosed
EP-1307077-A1 ADHESIVE FILM AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD COMPRISING THE SAME Ajinomoto Co., Inc. (JP) 2003-05-02 — — EP disclosed
US-20020076539-A1 Process for producing a multi-layer printer wiring board NAKAMURA SHIGEO (JP) 2002-06-20 — — US disclosed
US-6370350-B2 Method for developing electrostatic latent image and developing roller and developing device therefor RICOH COMPANY LIMITED (JP) 2002-04-09 — — US disclosed
US-20010014233-A1 Method for developing electrostatic latent image and developing roller and developing device therefor RICOH COMPANY LIMITED (JP) 2001-08-16 — — US disclosed
EP-0851726-A2 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same Ajinomoto Co., Inc. (JP) 1998-07-01 — — EP disclosed
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