⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14780679 | 1.00 | — | — | |
| SCHEMBL10283708 | 1.00 | — | — | |
| SCHEMBL36949 | 0.78 | HCAR2 (0.52) | — | |
| SCHEMBL13766654 | 0.78 | — | — | |
| SCHEMBL28127590 | 0.78 | — | — | |
| SCHEMBL250949 | 0.76 | ALDH1A1 (0.42) | — | |
| SCHEMBL21667491 | 0.76 | ALDH1A1 (0.42) | — | |
| SCHEMBL14370809 | 0.76 | ALDH1A1 (0.34) | — | |
| SCHEMBL24790886 | 0.75 | KEAP1 (0.33) | — | |
| SCHEMBL19924396 | 0.75 | ALDH1A1 (0.45) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114406256-B | Method for preparing three-dimensional structure hard alloy by adopting photo-curing 3D printing | 中南大学 | 2023-05-16 | — | — | CN | claimed |
| CN-114619042-B | Method for preparing tungsten material with three-dimensional structure by adopting photocuring 3D printing | 中南大学 | 2023-04-07 | — | — | CN | claimed |
| CN-114715894-A | Preparation method of nano tungsten carbide powder | 自贡硬质合金有限责任公司 | 2022-07-08 | — | — | CN | claimed |
| CN-114619042-A | Method for preparing tungsten material with three-dimensional structure by adopting photocuring 3D printing | 中南大学 | 2022-06-14 | — | — | CN | claimed |
| CN-114620998-A | Adhesive composition for powder 3D printing high-strength biscuit and printing method | 西北工业大学 | 2022-06-14 | — | — | CN | claimed |
| CN-114406256-A | Method for preparing three-dimensional structure hard alloy by adopting photocuring 3D printing | 中南大学 | 2022-04-29 | — | — | CN | claimed |
| CN-112321317-B | Preparation method of porous silicon oxide piezoelectric ceramic membrane | 南京工业大学 | 2022-04-01 | — | — | CN | claimed |
| CN-109627011-B | Preparation method of porous ceramic with concentric holes and porous ceramic | 萍乡学院 | 2022-02-18 | — | — | CN | claimed |
| CN-113354393-A | Preparation method for preparing IGZO (indium gallium zinc oxide) rotary target material by gel casting | 江苏迪丞光电材料有限公司 | 2021-09-07 | — | — | CN | claimed |
| CN-108893082-A | A kind of hot melt adhesive and preparation method thereof | 深圳市通产丽星股份有限公司 | 2018-11-27 | — | — | CN | claimed |
| US-7294663-B2 | Compatibility improvement in aromatic polyesters with mineral fillers | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-11-13 | — | — | US | claimed |
| CN-113454156-B | Resin composition and molded article | 三井—陶氏聚合化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-110582839-B | Radiation-curable adhesive tape for dicing | 古河电气工业株式会社 | 2023-06-06 | — | — | CN | disclosed |
| CN-114406256-B | Method for preparing three-dimensional structure hard alloy by adopting photo-curing 3D printing | 中南大学 | 2023-05-16 | — | — | CN | disclosed |
| CN-114619042-B | Method for preparing tungsten material with three-dimensional structure by adopting photocuring 3D printing | 中南大学 | 2023-04-07 | — | — | CN | disclosed |
| CN-108472940-A | The store method of layered body, packing container and food | 三菱瓦斯化学株式会社 | 2018-08-31 | — | — | CN | disclosed |
| CN-108207116-A | Semiconductor machining bonding sheet | 古河电气工业株式会社 | 2018-06-26 | — | — | CN | disclosed |
| CN-105189605-A | Process | NORNER IP AS | 2015-12-23 | — | — | CN | disclosed |
| CN-1183236-C | Lubricant for compression refrigerator using hydrocarbon refrigerant | 日本能源株式会社 | 2005-01-05 | — | — | CN | disclosed |
| CN-1297472-A | Lubricant for vapor compression refrigerator using hydrocarbon coolant | JAPAN ENERGY CORP (JP) | 2001-05-30 | — | — | CN | disclosed |