Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 5/20 | 0.66 |
| ▸ | LMNA | P02545 | 2/20 | 0.60 |
| ▸ | POLB | P06746 | 1/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.59 |
| ▸ | GAA | P10253 | 3/20 | 0.58 |
| ▸ | L3MBTL3 | Q96JM7 | 2/20 | 0.58 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.58 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.57 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.56 |
| ▸ | USP2 | O75604 | 2/20 | 0.56 |
| ▸ | MEN1 | O00255 | 1/20 | 0.55 |
| ▸ | HTT | P42858 | 1/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.55 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.55 |
| ▸ | TP53 | P04637 | 1/20 | 0.53 |
| ▸ | MAPT | P10636 | 1/20 | 0.53 |
| ▸ | TSHR | P16473 | 1/20 | 0.53 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28377650 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL180076 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL6902996 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL369227 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL367274 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL538527 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL472245 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL472260 | 1.00 | HPGD (0.66) | HPGDLMNAPOLBALDH1A1GAA | |
| SCHEMBL367502 | 0.98 | HPGD (0.65) | HPGDLMNAPOLBALDH1A1GAA | |
| Terephthalamide SCHEMBL198417 | 0.97 | HPGD (0.62) | HPGDLMNAPOLBALDH1A1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2414446-B1 | FLAME RESISTANT SEMIAROMATIC POLYAMIDE RESIN COMPOSITION AND ARTICLES THEREFROM | DU PONT (US) | 2013-02-13 | — | — | EP | claimed |
| EP-2414446-A1 | FLAME RESISTANT SEMIAROMATIC POLYAMIDE RESIN COMPOSITION AND ARTICLES THEREFROM | E. I. du Pont de Nemours and Company (US) | 2012-02-08 | — | — | EP | claimed |
| WO-2010117708-A1 | FLAME RESISTANT SEMIAROMATIC POLYAMIDE RESIN COMPOSITION AND ARTICLES THEREFROM | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-10-14 | — | — | WO | claimed |
| US-20100249292-A1 | FLAME RESISTANT SEMICAROMATIC POLYAMIDE RESIN COMPOSITION AND ARTICLES THEREFROM | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-09-30 | — | — | US | claimed |
| CN-111320868-B | Polymer composition with high dielectric constant and low dielectric loss | 杜邦聚合物有限公司 | 2023-02-28 | — | — | CN | disclosed |
| US-20220056267-A1 | POLYMERIC COMPOSITIONS WITH HIGH DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS | CELANESE POLYMERS HOLDING, INC. | 2022-02-24 | — | — | US | disclosed |
| CN-113614163-A | Polymer composition with high dielectric constant and low dielectric loss | 杜邦聚合物公司 | 2021-11-05 | — | — | CN | disclosed |
| CN-111944309-A | Polyamide composition capable of being stably molded | 江苏金发科技新材料有限公司 | 2020-11-17 | — | — | CN | disclosed |
| CN-111454570-A | Low resistivity polyamide composition | 杜邦公司 | 2020-07-28 | — | — | CN | disclosed |
| CN-111320868-A | Polymer composition with high dielectric constant and low dielectric loss | 杜邦聚合物有限公司 | 2020-06-23 | — | — | CN | disclosed |
| EP-2638110-B1 | HALOGEN-FREE FLAME RETARDANT POLYAMIDE COMPOSITION | DU PONT (US) | 2019-06-12 | — | — | EP | disclosed |
| EP-3013895-B1 | FLAME-RETARDANT POLYMER COMPOSITIONS | DU PONT (US) | 2017-12-06 | — | — | EP | disclosed |
| US-20120153217-A1 | THERMALLY CONDUCTIVE POLYMERIC RESIN COMPOSITION | E.I.DU PONT DE NEMOURS AND COMPANY (US) | 2012-06-21 | — | — | US | disclosed |
| EP-2456815-A1 | THERMALLY CONDUCTIVE POLYMER COMPOSITIONS AND ARTICLES MADE THEREFROM | Ticona LLC (US) | 2012-05-30 | — | — | EP | disclosed |
| WO-2012064965-A2 | HALOGEN-FREE FLAME RETARDANT POLYAMIDE COMPOSITION | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2012-05-18 | — | — | WO | disclosed |
| WO-2012044903-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2012-04-05 | — | — | WO | disclosed |
| US-20120080640-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2012-04-05 | — | — | US | disclosed |
| WO-2011126794-A2 | FLAME RESISTANT POLYAMIDE RESIN COMPOSITION AND ARTICLES COMRPISING THE SAME | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2011-10-13 | — | — | WO | disclosed |
| WO-2011010291-A1 | THERMALLY CONDUCTIVE POLYMER COMPOSITIONS AND ARTICLES MADE THEREFROM | TICONA LLC (US) | 2011-01-27 | — | — | WO | disclosed |
| US-20100249292-A1 | FLAME RESISTANT SEMICAROMATIC POLYAMIDE RESIN COMPOSITION AND ARTICLES THEREFROM | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-09-30 | — | — | US | disclosed |