SCHEMBL5400951

SCHEMBL5400951

CC[C](CC)C1CCCCC1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.41
CES1 P23141 1/20 0.41
HSD11B1 P28845 1/20 0.38
NAAA Q02083 1/20 0.36
SHBG P04278 1/20 0.36
MGLL Q99685 1/20 0.36
ALDH1A1 P00352 3/20 0.35
HDAC8 Q9BY41 1/20 0.35
HDAC6 Q9UBN7 1/20 0.35
CYP1A2 P05177 1/20 0.35
TSHR P16473 3/20 0.33
EPHX1 P07099 1/20 0.33
NOS2 P35228 1/20 0.33
RECQL P46063 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
HSD17B10 Q99714 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA4 P22748 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5408882 0.97 CES2 (0.36) CES2CES1HSD11B1NAAASHBG
SCHEMBL5397294 0.91
SCHEMBL5420436 0.87
SCHEMBL16703624 0.85 NAAA (0.36) CES2CES1HSD11B1NAAASHBG
SCHEMBL3659402 0.83 CYP1A2 (0.38) CES2CES1HSD11B1NAAASHBG
SCHEMBL4224634 0.83 CYP1A2 (0.38) CES2CES1HSD11B1NAAASHBG
SCHEMBL11653900 0.83 CYP1A2 (0.38) CES2CES1HSD11B1NAAASHBG
SCHEMBL4449483 0.83 CYP1A2 (0.38) CES2CES1HSD11B1NAAASHBG
SCHEMBL23501850 0.78 NAAA (0.38) CES2CES1HSD11B1NAAASHBG
SCHEMBL6990609 0.77 CES2 (0.41) CES2CES1HSD11B1NAAASHBG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106574057-A High melt strength polypropylene and extrusion process for maintaining melt strength 埃克森美孚化学专利公司 2017-04-19 CN disclosed
CN-1957023-A Particle with rough surface for plating or vapor deposition NISSHIN SPINNING (JP) 2007-05-02 CN disclosed
US-7192684-B2 Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-20 US disclosed
US-20040067436-A1 Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-04-08 US disclosed