⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1367396 | 1.00 | — | — | |
| SCHEMBL285205 | 0.81 | — | — | |
| Ammonia Solution, Strong SCHEMBL278251 | 0.79 | — | — | |
| Ammonia Solution, Strong SCHEMBL7106957 | 0.79 | — | — | |
| SCHEMBL1630421 | 0.79 | — | — | |
| SCHEMBL29220047 | 0.77 | ALDH1A1 (0.32) | — | |
| SCHEMBL5959242 | 0.68 | MAOB (0.37) | — | |
| SCHEMBL5959246 | 0.68 | MAOB (0.37) | — | |
| SCHEMBL994273 | 0.67 | — | — | |
| Cyclohexane SCHEMBL7945022 | 0.66 | MAPT (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 193 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115305047-A | Layer-adding adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2022-11-08 | — | — | CN | claimed |
| US-20180031510-A1 | HUMIDITY SENSOR | HONEYWELL INTERNATIONAL INC., A DELAWARE CORPORATION | 2018-02-01 | — | — | US | claimed |
| EP-3259581-A1 | HUMIDITY SENSOR AND METHOD FOR MANUFACTURING THE SENSOR | Honeywell International Inc. (US) | 2017-12-27 | — | — | EP | claimed |
| US-9427948-B2 | Manufacturing a flexible structure by transfers of layers | COMMISSARIATE A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2016-08-30 | — | — | US | claimed |
| WO-2016134079-A1 | HUMIDITY SENSOR AND METHOD FOR MANUFACTURING THE SENSOR | HONEYWELL INTERNATIONAL INC. (US) | 2016-08-25 | — | — | WO | claimed |
| US-8916423-B2 | Semiconductor device and method of manufacturing the same | FUJITSU SEMICONDUCTOR LIMITED (JP) | 2014-12-23 | — | — | US | claimed |
| US-8778800-B1 | Methods of making supercapacitor cells and micro-supercapacitors | HRL LABORATORIES, LLC (US) | 2014-07-15 | — | — | US | claimed |
| US-20130320508-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU SEMICONDUCTOR LIMITED (JP) | 2013-12-05 | — | — | US | claimed |
| US-8503161-B1 | Supercapacitor cells and micro-supercapacitors | HRL LABORATORIES, LLC (US) | 2013-08-06 | — | — | US | claimed |
| EP-2081230-B1 | Photodetecting device, radiation detecting device, and radiation imaging system | CANON KK (JP) | 2012-02-08 | — | — | EP | claimed |
| US-7867688-B2 | coating first layer of resist material on a substrate, creating a pattern on substrate material by image wise radiation induced thermal removal of first resist material to expose substrate, plasma etching substrate which has been exposed, and removing residual resist with oxygen | EASTMAN KODAK COMPANY (US) | 2011-01-11 | — | — | US | claimed |
| WO-2007142788-A2 | LASER ABLATION RESIST | EASTMAN KODAK COMPANY (US) | 2007-12-13 | — | — | WO | claimed |
| US-20070281247-A1 | LASER ABLATION RESIST | EASTMAN KODAK COMPANY | 2007-12-06 | — | — | US | claimed |
| US-7101591-B2 | Production method for copolymer film, copolymer film produced by the forming method and semiconductor device using copolymer film | NEC CORPORATION (JP) | 2006-09-05 | — | — | US | claimed |
| EP-0783179-B1 | Manufacturing method of a SiO2 layer on a topography | INFINEON TECHNOLOGIES AG (DE) | 2006-05-17 | — | — | EP | claimed |
| US-20040063883-A1 | Prduction method for copolymer film, copolymer film produced by the forming method and semiconductor device using copolymer film | NEC CORPORATION (JP) | 2004-04-01 | — | — | US | claimed |
| US-6713357-B1 | Method to reduce parasitic capacitance of MOS transistors | ADVANCED MICRO DEVICES, INC. | 2004-03-30 | — | — | US | claimed |
| US-20040041269-A1 | Semiconductor device and manufacturing method thereof | NEC ELECTRONICS CORPORATION | 2004-03-04 | — | — | US | claimed |
| US-6458516-B1 | Method of etching dielectric layers using a removable hardmask | APPLIED MATERIALS INC. | 2002-10-01 | — | — | US | claimed |
| US-5879572-A | Method of protecting silicon wafers during wet chemical etching | DELCO ELECTRONICS CORPORATION (US) | 1999-03-09 | — | — | US | claimed |