SCHEMBL5418154

SCHEMBL5418154

CCc1nnnc(CC)c1CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9421996 0.80
SCHEMBL3875955 0.76 KDM4E (0.30)
SCHEMBL25953602 0.73 GAA (0.33)
SCHEMBL14606595 0.67 GLA (0.32)
SCHEMBL31555371 0.67 GAA (0.30)
SCHEMBL4530241 0.67 GAA (0.30)
SCHEMBL19834902 0.67 NOS3 (0.33)
SCHEMBL2971407 0.67
SCHEMBL13766095 0.67
SCHEMBL12705661 0.67 HTT (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117885032-A Diamond grinding pad and preparation method thereof 普利英(重庆)创新科技有限公司 2024-04-16 CN disclosed
CN-117800308-A Preparation method and application of ammonium ferromanganese phosphate and lithium ferromanganese phosphate 东莞东阳光科研发有限公司 2024-04-02 CN disclosed
CN-117659762-A High-sensitivity heat-and-humidity-resistant thermosensitive microcapsule dispersion liquid, preparation method and thermosensitive film 南阳柯丽尔科技有限公司 2024-03-08 CN disclosed
CN-117004212-A Polymer matrix composite and printed circuit board 江西联茂电子科技有限公司 2023-11-07 CN disclosed
CN-117004211-A Polymer matrix composite and printed circuit board 江西联茂电子科技有限公司 2023-11-07 CN disclosed
CN-112424238-B Resin composition 引能仕株式会社 2023-07-25 CN disclosed
CN-114824220-A Negative electrode active material for nonaqueous electrolyte secondary battery, method for producing negative electrode, and nonaqueous electrolyte secondary battery 信越化学工业株式会社 2022-07-29 CN disclosed
CN-112029073-A Epoxy resin curing agent, reaction method, and curable epoxy resin composition 株式会社艾迪科 2020-12-04 CN disclosed
CN-103402975-A Beta-hydroxyalkylamide and resin composition TOYO INK SC HOLDINGS CO LTD 2013-11-20 CN disclosed
CN-102985971-A Method for manufacturing glass substrate for magnetic disk and method for manufacturing magnetic disk HOYA CORP 2013-03-20 CN disclosed
CN-102854744-A Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin TOYO INK SC HOLDINGS CO LTD 2013-01-02 CN disclosed
US-20070137675-A1 Method for removal of flux and other residue in dense fluid systems VERSUM MATERIALS US, LLC 2007-06-21 US disclosed
US-7195676-B2 Method for removal of flux and other residue in dense fluid systems AIR PRODUCTS AND CHEMICALS, INC. (US) 2007-03-27 US disclosed
US-20060081273-A1 Dense fluid compositions and processes using same for article treatment and residue removal AIR PRODUCTS AND CHEMICALS, INC. 2006-04-20 US disclosed
US-20060011217-A1 Method for removal of flux and other residue in dense fluid systems AIR PRODUCTS AND CHEMICALS, INC. 2006-01-19 US disclosed
CN-1177809-C Novel polyamino acid derivative ֮����ʽ���� 2004-12-01 CN disclosed
CN-1247188-A Novel polyamino acid derivative AJINOMOTO KK (JP) 2000-03-15 CN disclosed