Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 1/20 | 0.30 |
| ▸ | HEXA | P06865 | 1/20 | 0.30 |
| ▸ | HEXB | P07686 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25953602 | 0.87 | GAA (0.33) | GAA | |
| SCHEMBL18610457 | 0.73 | — | — | |
| SCHEMBL210649 | 0.71 | — | — | |
| Ether SCHEMBL4956585 | 0.70 | — | — | |
| SCHEMBL17255291 | 0.70 | NOS3 (0.34) | GAA | |
| SCHEMBL11736498 | 0.67 | — | — | |
| SCHEMBL5418154 | 0.67 | — | — | |
| SCHEMBL8850053 | 0.67 | PGK1 (0.36) | GAA | |
| SCHEMBL13822465 | 0.65 | — | — | |
| SCHEMBL27269247 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109843981-B | Polycarbonate imide resin and resin composition containing the same | 东洋纺株式会社 | 2022-05-31 | — | — | CN | disclosed |
| WO-2020116512-A1 | CURABLE RESIN COMPOSITION, DRY FILM, RESIN-CLAD COPPER FOIL, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽インキ製造株式会社 | 2020-06-11 | — | — | WO | disclosed |
| US-20120285835-A1 | ADHESION PROMOTION OF METAL TO A DIELECTRIC | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-11-15 | — | — | US | disclosed |
| US-20090065244-A1 | THERMOSETTING RESIN COMPOSITIONS AND USES THEREOF | SHOWA DENKO K.K. (JP) | 2009-03-12 | — | — | US | disclosed |
| CN-1240741-C | Urethane oligomer, resin composition thereof, and cured article thereof | NIPPON KAYAKU KK (JP) | 2006-02-08 | — | — | CN | disclosed |
| US-6716892-B1 | PRINTED CIRCUIT BOARD; WATER SOLUBILITY; ACRYLATED POLYESTER URETHANE AND AN ACRYLATED EPOXY RESIN | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2004-04-06 | — | — | US | disclosed |
| CN-1344286-A | Urethane oligomer, resin compsns. thereof, and cured article thereof | NIPPON KAYAKU KK (JP) | 2002-04-10 | — | — | CN | disclosed |
| EP-1170315-A1 | URETHANE OLIGOMER, RESIN COMPOSITIONS THEREOF, AND CURED ARTICLE THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2002-01-09 | — | — | EP | disclosed |