⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7633172 | 0.76 | — | — | |
| SCHEMBL17418143 | 0.72 | — | — | |
| SCHEMBL3391288 | 0.69 | — | — | |
| SCHEMBL3096493 | 0.69 | — | — | |
| SCHEMBL704716 | 0.69 | — | — | |
| SCHEMBL9303139 | 0.69 | TET2 (0.34) | — | |
| SCHEMBL2779249 | 0.67 | ALOX15 (0.36) | — | |
| SCHEMBL703194 | 0.67 | — | — | |
| SCHEMBL11271953 | 0.67 | MAPK1 (0.36) | — | |
| SCHEMBL11812098 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 155 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7172657-B2 | Cleaning method of treatment equipment and treatment equipment | TOKYO ELECTRON LIMITED (JP) | 2007-02-06 | — | — | US | claimed |
| EP-0854507-B1 | Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same | SHARP KK (JP) | 2006-06-07 | — | — | EP | claimed |
| EP-0854507-A2 | Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same | SHARP KABUSHIKI KAISHA (JP) | 1998-07-22 | — | — | EP | claimed |
| US-5767301-A | COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION | SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) | 1998-06-16 | — | — | US | claimed |
| US-20250389016-A1 | GAS BARRIER FILM MATERIAL, SILICON OXIDE FILM, AND PRODUCTION METHOD OF SILICON OXIDE FILM | TOSOH CORP (JP) | 2025-12-25 | — | — | US | disclosed |
| EP-4641292-A1 | SILICONE PARTICLES AND LIGHT-DIMMING LAMINATE | Sekisui Chemical Co., Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| EP-4596511-A1 | LAMINATED GLASS AND AUTOMOBILE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596510-A1 | LIGHT MODULATING BODY, LAMINATED GLASS, AND AUTOMOBILE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-3378914-B1 | CONNECTING MATERIAL AND CONNECTION STRUCTURE | SEKISUI CHEMICAL CO LTD (JP) | 2025-08-06 | — | — | EP | disclosed |
| WO-2025127132-A1 | RESIN PARTICLES AND LIGHT CONTROL LAMINATE | 積水化学工業株式会社 | 2025-06-19 | — | — | WO | disclosed |
| US-12288629-B2 | Conductive particles and connection structure | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-04-29 | — | — | US | disclosed |
| CN-114207025-B | Resin particle, conductive material, and connection structure | 积水化学工业株式会社 | 2025-02-25 | — | — | CN | disclosed |
| US-20010020478-A1 | Cleaning method of tratment equipment and treatment equipment | TOKYO ELECTRON LIMITED (JP) | 2001-09-13 | — | — | US | disclosed |
| EP-1051461-A2 | FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE | ORR, William C. (US) | 2000-11-15 | — | — | EP | disclosed |
| EP-0987346-A1 | Copper deposition method using a precursor with (alkyloxy) (alkyl)silylolefin ligands | Sharp Kabushiki Kaisha (JP) | 2000-03-22 | — | — | EP | disclosed |
| WO-1999066009-A2 | FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE | ORR WILLIAM C (US) | 1999-12-23 | — | — | WO | disclosed |
| EP-0855399-A2 | Precursor with alkylaminosilylolefin ligands to deposit copper and method for same | SHARP KABUSHIKI KAISHA (JP) | 1998-07-29 | — | — | EP | disclosed |
| EP-0854507-A2 | Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same | SHARP KABUSHIKI KAISHA (JP) | 1998-07-22 | — | — | EP | disclosed |
| US-5767301-A | COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION | SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) | 1998-06-16 | — | — | US | disclosed |
| US-4181788-A | Process for the production of thermoplastic molding materials based on vinyl polymers | BAYER AKTIENGESELLSCHAFT (DE) | 1980-01-01 | — | — | US | disclosed |