SCHEMBL3096493

SCHEMBL3096493

C=C([SiH3])C(C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6735407 0.71
SCHEMBL5420073 0.69
SCHEMBL1147760 0.68
SCHEMBL19332930 0.65 ALDH1A1 (0.30)
SCHEMBL3096760 0.63 ALDH1A1 (0.33)
SCHEMBL702327 0.63
SCHEMBL8993683 0.62 ALDH1A1 (0.61)
SCHEMBL735369 0.60
SCHEMBL607413 0.58
SCHEMBL318619 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 159 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7172657-B2 Cleaning method of treatment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2007-02-06 US claimed
EP-0854507-B1 Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same SHARP KK (JP) 2006-06-07 EP claimed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP claimed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US claimed
EP-4641292-A1 SILICONE PARTICLES AND LIGHT-DIMMING LAMINATE Sekisui Chemical Co., Ltd. (JP) 2025-10-29 EP disclosed
EP-3378914-B1 CONNECTING MATERIAL AND CONNECTION STRUCTURE SEKISUI CHEMICAL CO LTD (JP) 2025-08-06 EP disclosed
EP-4596511-A1 LAMINATED GLASS AND AUTOMOBILE SEKISUI CHEMICAL CO., LTD. (JP) 2025-08-06 EP disclosed
EP-4596510-A1 LIGHT MODULATING BODY, LAMINATED GLASS, AND AUTOMOBILE SEKISUI CHEMICAL CO., LTD. (JP) 2025-08-06 EP disclosed
WO-2025127132-A1 RESIN PARTICLES AND LIGHT CONTROL LAMINATE 積水化学工業株式会社 2025-06-19 WO disclosed
US-12288629-B2 Conductive particles and connection structure SEKISUI CHEMICAL CO., LTD. (JP) 2025-04-29 US disclosed
CN-113950778-B Conductive particle, conductive material, and connection structure 积水化学工业株式会社 2025-04-04 CN disclosed
CN-114207025-B Resin particle, conductive material, and connection structure 积水化学工业株式会社 2025-02-25 CN disclosed
US-20010020478-A1 Cleaning method of tratment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2001-09-13 US disclosed
EP-1051461-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR, William C. (US) 2000-11-15 EP disclosed
EP-0987346-A1 Copper deposition method using a precursor with (alkyloxy) (alkyl)silylolefin ligands Sharp Kabushiki Kaisha (JP) 2000-03-22 EP disclosed
WO-1999066009-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR WILLIAM C (US) 1999-12-23 WO disclosed
EP-0954558-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR, William C. (US) 1999-11-10 EP disclosed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP disclosed
WO-1998026028-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 1998-06-18 WO disclosed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US disclosed