SCHEMBL5435699

SCHEMBL5435699

CC(C)(C)OOOC(=O)c1ccccc1C(=O)O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.51
HSD17B10 Q99714 4/20 0.51
TSHR P16473 3/20 0.51
TDP1 Q9NUW8 2/20 0.51
ALOX15 P16050 2/20 0.48
AKR1C3 P42330 2/20 0.40
KDM4E B2RXH2 4/20 0.40
HPGD P15428 3/20 0.40
HMGB1 P09429 2/20 0.40
NAPRT Q6XQN6 2/20 0.40
ESR1 P03372 1/20 0.40
ITGB3 P05106 1/20 0.40
ITGA2B P08514 1/20 0.40
GGT1 P19440 1/20 0.40
PTGS1 P23219 1/20 0.40
PTGS2 P35354 1/20 0.40
BLM P54132 1/20 0.40
LMNA P02545 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP2C9 P11712 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29390328 0.93 TSHR (0.53) ALDH1A1HSD17B10TSHRTDP1KDM4E
SCHEMBL629428 0.93 TSHR (0.53) ALDH1A1HSD17B10TSHRTDP1KDM4E
SCHEMBL2477857 0.89 ALDH1A1 (0.65) ALDH1A1HSD17B10TSHRTDP1ALOX15
SCHEMBL3924014 0.85 ALDH1A1 (0.56) ALDH1A1HSD17B10TSHRTDP1AKR1C3
SCHEMBL9015728 0.85 TSHR (0.46) ALDH1A1HSD17B10TSHRTDP1ALOX15
Benzene SCHEMBL12472151 0.83 TSHR (0.71) ALDH1A1HSD17B10TSHRTDP1ALOX15
Phthalic Acid SCHEMBL11341997 0.83 ALDH1A1 (0.64) ALDH1A1HSD17B10TSHRTDP1ALOX15
Phthalic Acid SCHEMBL28010232 0.83 ALDH1A1 (0.64) ALDH1A1HSD17B10TSHRTDP1ALOX15
SCHEMBL8083374 0.83 ALDH1A1 (0.64) ALDH1A1HSD17B10TSHRALOX15AKR1C3
Phthalic Acid SCHEMBL28576584 0.83 ALDH1A1 (0.64) ALDH1A1HSD17B10TSHRALOX15AKR1C3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111116814-B Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2022-08-30 CN claimed
CN-111116814-A Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2020-05-08 CN claimed
CN-110922536-A Pre-polymerized resin and application thereof 台光电子材料(昆山)有限公司 2020-03-27 CN claimed
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
CN-118475639-A Capped poly (phenylene ether) s and curable thermoset compositions containing the same 高新特殊工程塑料全球技术有限公司 2024-08-09 CN disclosed
CN-114456574-B Prepreg and product thereof 台光电子材料股份有限公司 2024-07-02 CN disclosed
CN-114181511-B Resin composition and product thereof 台光电子材料股份有限公司 2024-06-25 CN disclosed
EP-3822091-B1 PNEUMATIC TIRE WITH ACOUSTIC DAMPER, AND METHOD FOR MANUFACTURING SAID TIRE SUMITOMO RUBBER IND (JP) 2024-05-29 EP disclosed
CN-114207068-B Polyolefin adhesive composition 东洋纺MC株式会社 2024-04-02 CN disclosed
CN-114573760-B Prepolymer, resin composition comprising the same, and articles thereof 台光电子材料股份有限公司 2024-01-26 CN disclosed
CN-114341301-B Polyolefin adhesive composition 东洋纺MC株式会社 2023-09-29 CN disclosed
CN-113248917-A Resin composition and product thereof 台光电子材料(昆山)有限公司 2021-08-13 CN disclosed
EP-3822091-A1 PNEUMATIC TIRE WITH ACOUSTIC DAMPER, AND METHOD FOR MANUFACTURING SAID TIRE Sumitomo Rubber Industries, Ltd. (JP) 2021-05-19 EP disclosed
CN-112210210-A Resin composition and product thereof 台光电子材料(昆山)有限公司 2021-01-12 CN disclosed
CN-112011181-A Resin composition and product thereof 台光电子材料(昆山)有限公司 2020-12-01 CN disclosed
CN-111116814-A Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2020-05-08 CN disclosed
CN-110922536-A Pre-polymerized resin and application thereof 台光电子材料(昆山)有限公司 2020-03-27 CN disclosed
US-20070072089-A1 Holographic recording medium KABUSHIKI KAISHA TOSHIBA (JP) 2007-03-29 US disclosed
US-5637667-A INCLUDES CURING AGENT, POLYSILANE COPOLYMER, AND INORGANIC FILLER KABUSHIKI KAISHA TOSHIBA (JP) 1997-06-10 US disclosed
US-5438113-A Heat and humidity resistant plastics having low internal stresses, for encapsulating semiconductors KABUSHIKI KAISHA TOSHIBA (JP) 1995-08-01 US disclosed