SCHEMBL5458463

SCHEMBL5458463

CO[Si](OC)(OC)O[Si](C)(C)O[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5465996 0.96
SCHEMBL26121730 0.90
SCHEMBL679184 0.90
SCHEMBL1221739 0.89
SCHEMBL12387145 0.87
SCHEMBL19497424 0.87
SCHEMBL1700006 0.87
SCHEMBL1700048 0.87
SCHEMBL12387175 0.87
SCHEMBL1700008 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215210-A1 DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME ETIC INC. (JP) 2025-07-03 US disclosed
EP-4502015-A1 DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME Etic Inc. (JP) 2025-02-05 EP disclosed
US-20250011628-A1 RELEASE COMPOSITION, ARTICLES PREPARED FROM THE RELEASE COMPOSITION, AND RELATED METHODS 3M INNOVATIVE PROPERTIES COMPANY 2025-01-09 US disclosed
EP-4433525-A1 RELEASE COMPOSITION, ARTICLES PREPARED FROM THE RELEASE COMPOSITION, AND RELATED METHODS 3M Innovative Properties Company (US) 2024-09-25 EP disclosed
CN-118302476-A Stripping composition, articles made from stripping composition, and related methods 3M创新有限公司 2024-07-05 CN disclosed
WO-2023190934-A1 DIENE RUBBER COMPOSITION AND METHOD FOR PRODUCING SAME 有限会社ETIC 2023-10-05 WO disclosed
US-20230183483-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD FOR SAME, AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-15 US disclosed
US-20230167347-A1 THERMAL CONDUCTIVE SILICONE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-01 US disclosed
WO-2023091407-A1 RELEASE COMPOSITION, ARTICLES PREPARED FROM THE RELEASE COMPOSITION, AND RELATED METHODS 3M INNOVATIVE PROPERTIES COMPANY (US) 2023-05-25 WO disclosed
US-9074101-B2 Siloxane-grafted silica, transparent silicone composition, and optoelectronic device encapsulated therewith NIIGATA UNIVERSITY (JP) 2015-07-07 US disclosed
US-20090121180-A1 SILOXANE-GRAFTED SILICA, TRANSPARENT SILICONE COMPOSITION, AND OPTOELECTRONIC DEVICE ENCAPSULATED THEREWITH SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-05-14 US disclosed
US-20080075895-A1 Optical Laminated Film for Liquid Crystal Display Device MATSUSHITA ELECTRIC WORKS, LTD. (JP) 2008-03-27 US disclosed
US-20070178319-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) 2007-08-02 US disclosed
EP-1564269-A1 COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2005-08-17 EP disclosed
US-20040216641-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-11-04 US disclosed